Asahi/America, Inc. now offers its T-342 diaphragm valves with optional sanitary adapter end connectors.
Henkel Non-Conductive Die Attach Film Offers Broad Wirebond Package Flexibility
Henkel today announced the commercialization of a high-performance non-conductive die attach film (ncDAF) engineered to address the demands of contemporary packaging device designs.
CVD Deposition, Plating and Sputter Target Materials Looking Strong Despite Threat of Semiconductor Market Slowdown
Advanced packaging and interconnect layers driving growth through ‘26.
After Record Sales in 2022, Semi Sales Forecast to Fall -5% in 2023
Collapsing memory prices and uncertain global economy weigh on next year’s growth.
Ixana Raises $3M with Breakthrough Wearable Silicon Chip
Ixana, the wearable hardware company developing high-speed human-computer interfaces, today announced it has closed $3 million in seed funding and is backed by Uncorrelated Ventures, Samsung Next, Evonexus, Paradigm Shift and Hack VC.
Explainable AI-Based Physical Theory for Advanced Materials Design
Scientists develop an “extended Landau free energy model” for causal analysis and visualization in nano-magnetic devices with AI and topology.
Advantest Introduces New inteXcell Series of High-Performance, Economical Test Cells for Advanced Memory ICs
Semiconductor test equipment supplier Advantest Corporation has launched inteXcell, a new line of minimal-footprint test cells designed to address demanding final-test requirements presented by the increasing bit densities, lower power consumption and faster interface speeds of future memory devices.
Nanoengineers Develop a Predictive Database for Materials
A breakthrough algorithm expands the exploration space for materials by orders of magnitude.
Silicon Labs CEO Matt Johnson Elected Chair of Semiconductor Industry Association
Texas Instruments CEO Rich Templeton elected SIA Vice Chair.
Bechtel to Build Intel’s Semiconductor Manufacturing Facilities in Ohio
Bechtel today announced it was selected by Intel to build Intel’s new semiconductor manufacturing facilities in New Albany, Licking County, Ohio.
