Shannon Davis

News and Web Editor

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Shannon, writes, edits and produces Semiconductor Digest’s news articles, email newsletters, blogs, webcasts, and social media posts. She holds a bachelor’s degree in journalism from Huntington University in Huntington, IN. In addition to her years of freelance business reporting, Shannon has also worked in marketing and public relations in the renewable energy and healthcare industries.

Lattice Announces CFO Transition

Lattice Semiconductor today announced the resignation of its Chief Financial Officer (CFO), Sherri Luther, effective immediately, to pursue a new opportunity.

UCSB Researchers Create the First Ever Visualization of Photoexcited Charges Traveling Across the Interface of Two Semiconductor Materials

UC Santa Barbara researchers have achieved the first-ever “movie” of electric charges traveling across the interface of two different semiconductor materials.

Engineering Perovskite Materials at the Atomic Level Paves Way for New Lasers, LEDs

Researchers have developed and demonstrated a technique that allows them to engineer a class of materials called layered hybrid perovskites (LHPs) down to the atomic level, which dictates precisely how the materials convert electrical charge into light.

Energetiq Technology Unveils Next-Generation Electrodeless Z-Pinch EUV Light Source for Metrology

Energetiq Technology announced the launch of the EQS-10 Electrodeless Z-Pinch EUV Light Source.

IMEC Announces Commitments to Automotive Chiplet Program

This week, at an exclusive gathering in Detroit (MI), bringing together the global automotive ecosystem to discuss the evolution towards chiplets in cars (Automotive Chiplet Forum 2024), imec announced that Arm, ASE, BMW Group, Bosch, Cadence Design Systems, Inc., Siemens, SiliconAuto, Synopsys, Tenstorrent and Valeo are the first that have committed to join its Automotive Chiplet Program (ACP).

SEALSQ Getting Ready for the Arrival of Quantum Computers

As quantum-computing brings a paradigm shift in computational power by harnessing the principles of quantum mechanics, the need for enhanced security has never been greater.

Lantronix Announces Five New System-in-Package Solutions Powered by Qualcomm

Lantronix Inc. today announced its powerful new System-in-Package (SiP) solutions powered by Qualcomm Technologies’ chipsets that reinforce Lantronix’s position in industrial and enterprise IoT innovation, bringing advanced Artificial Intelligence (AI) and Machine Learning (ML) capabilities to the edge.

Infineon and AWL-Electricity Partner to Improve Wireless Power with GaN Power Semiconductors

Infineon Technologies AG today announced a partnership with Canada-based AWL-Electricity Inc., a pioneer in MHz resonant capacitive coupling power transfer technology.

Ceramic Equipment Components Growth Trend 2025

Semiconductor equipment components market to grow in support of chip expansions.

Keysight Unveils 3kV High Voltage Wafer Test System for Power Semiconductors

Increased productivity and efficiency with one-pass test enabled by a high-voltage switching matrix.