Researchers achieve higher energy efficiency by using a directional antenna and a directional beam for charging the sensor node.
Industry Strategy Symposium 2023 to Highlight ‘Reaching $1T the Right Way: A Sustainable Path’
SEMI announced today that Industry Strategy Symposium (ISS) 2023 will be held January 8-11 at the Ritz-Carlton in Half Moon Bay, Calif. with the theme Reaching $1T the Right Way: A Sustainable Path.
SiPearl and AMD Collaborate to Address Exascale Supercomputing in Europe
SiPearl has entered into a business collaboration agreement with AMD.
Chung-Ang University Researchers Develop a Meta-Reinforcement Learning Algorithm for Traffic Signal Control
The algorithm automatically customizes reward functions based on the classification of traffic regimes to solve nonstationary traffic signal control problems.
SEMICON Europa 2022 Opens Tomorrow with Focus on Accelerating Semiconductor Industry Innovation
Industry experts from across the electronics design and manufacturing supply chain will gather starting tomorrow at SEMICON Europa 2022 for the latest developments and trends across key semiconductor industry growth segments.
After 1Q23 Bottom, Expectations Increase for a 2Q23 IC Market Rebound
Notably, the IC market has never shown more than three sequential quarters of decline.
Creating Efficient Building Energy Management Systems from Room-Level Big Data
This study describes the first step of a scalable, bottom-up approach to developing energy-saving initiatives at the individual level.
Deci and Intel Collaborate to Accelerate Journey Towards More Scalable AI
With the power of Deci’s Automated Neural Architecture Construction (AutoNAC) technology, developers are better suited to build, optimize, and deploy more powerful deep learning models using Intel Chips.
Micron DDR5 Memory Now Available for 4th Gen AMD EPYC Processors
Micron Technology, Inc. today announced availability of DDR5 memory for the data center that is validated for the new AMD EPYC 9004 Series processors.
ACM Research Adds Metal Lift Off Capability to Ultra C pr Tool to Support Power Semiconductor Manufacturing and Wafer Level Packaging Applications
ACM Research, Inc. today announced that it has expanded its Ultra C pr product offering to include metal lift-off (MLO) capabilities for power semiconductor manufacturing and wafer level packaging (WLP) applications.
