Nexperia, the expert in essential semiconductors, today announced a broadening to its portfolio of power management products to include energy harvesting solutions.
Pearl Semiconductor Announces its SingleDie Technology for Timing Solutions
Pearl Semiconductor, a high-performance timing device company, today announced the first ever true single-die reference clock technology.
Trelleborg to Showcase Two New Isolast PureFab FFKM Materials at Semicon Europa 2022
Trelleborg Sealing Solutions showcases two new additions to its Isolast PureFab FFKM material range at Semicon Europa 2022 at Neue München, Munich, Germany, at booth number C1.842 from November 15 to 18.
Xiphera and Flex Logix Publish Joint White Paper on Solving the Quantum Threat with Post-Quantum Cryptography on eFPGA
Xiphera Ltd, a Finnish company designing and licensing cryptographic IP cores for FPGAs and ASICs, announced today that it has published a new white paper with Flex Logix.
ASE Breaks Ground on New Chip Assembly and Testing Facility in Penang, Malaysia
The new facility at ASE Malaysia (ASEM) will comprise 2 buildings (Plants 4 and 5) with a built-up area of 982,000 square feet, located in the Bayan Lepas Free Industrial Zone.
Ayar Labs Expands Executive Team to Lead the Next Phase of Growth in Optical I/O Production and Broad Commercial Adoption
Ayar Labs has expanded its executive team to further commercial development, with the addition of Lakshmikant (LK) Bhupathi, Vice President of Products, Strategy and Ecosystem, and Scott Clark, Vice President of Manufacturing and Operations.
Electrically Conductive Adhesive from Henkel Designed to Accommodate Compact Camera Module Complexity
Henkel continues to lead in consumer electronic material solutions and today announced its latest innovation, an electrically conductive adhesive (ECA) that cures at room temperature, improving yield rates and protecting sensitive structures within mobile device compact camera modules (CCMs).
Tektronix Partners with BRIDG to Boost Domestic Semiconductor Package Testing
This collaboration will expand advanced semiconductor package testing capabilities in the US.
Erbium Atoms in Silicon: A Prime Candidate for Quantum Networks
A team of researchers at the MPQ has pioneered the integration of erbium atoms with special optical properties into a silicon crystal.
Omar Abed to Succeed Amir Panush as CEO of InvenSense and General Manager of MEMS Sensor Business Group
TDK Corporation announces that, effective January 1, 2023, Mr. Omar Abed will assume the role of Chief Executive Officer (CEO) of InvenSense, Inc.
