Shannon Davis

News and Web Editor

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Shannon, writes, edits and produces Semiconductor Digest’s news articles, email newsletters, blogs, webcasts, and social media posts. She holds a bachelor’s degree in journalism from Huntington University in Huntington, IN. In addition to her years of freelance business reporting, Shannon has also worked in marketing and public relations in the renewable energy and healthcare industries.

Entegris Appoints Mary Puma to Board of Directors

Entegris, Inc., a supplier of advanced materials and process solutions for the semiconductor and other high-technology industries, today announced the appointment of Mary Puma to its board of directors.

Starting a Fluorescent Biosensor Revolution

Molecular biosensors that only light up upon binding their targets open vast possibilities for medical diagnostics, fundamental research, environmental monitoring, and more.

ROHM and UAES Sign a Long-Term Supply Agreement for SiC Power Devices

ROHM Semiconductor and United Automotive Electronic Systems Co., Ltd. (UAES), a Tier 1 automotive supplier in China, today announced they have entered into a long-term supply agreement for SiC power devices.

Micron Introduces HBM3E 12-high 36GB

Micron’s HBM3E 12-high 36GB delivers significantly lower power consumption than other 8-high 24GB offerings, despite having 50% more DRAM capacity in the package.

DELO Introduces New Microelectronics Adhesive for Ultra-Fine Structures

DELO has developed a new adhesive that can be used to create ultra-fine structures within seconds.

Applied Materials Appoints Florent Ducrot as Head of European Operations

Applied Materials, Inc. today announced Florent Ducrot, Vice President and General Manager, to serve as the Head of European Operations.

ACM Research Receives Orders for Wafer-Level Packaging Tools from U.S. Customer and R&D Center

ACM Research, Inc. today announced it has received purchase orders for four wafer-level packaging tools, including two from a U.S.-based customer and two from a U.S.-based research and development (R&D) center.

Q2 2024 Global Semiconductor Equipment Billings Increased 4% Year-Over-Year, SEMI Reports

Global semiconductor equipment billings increased 4% year-over-year to US$26.8 billion in the second quarter of 2024, while quarter-over-quarter billings edged up 1% during the same period.

Applied Ventures and ITIC Taiwan Joins Series B Funding For Wise-integration’s ‘Disruptive’ Technology

Wise-integration today announced that the investment fund, Applied Ventures-ITIC Innovation Fund (AVITIC), joined the company’s Series B funding round.

How Semiconductor Technologies are Enabling the Next Wave of Augmented Reality

The rapid advancement of Augmented Reality (AR) technology is pushing the boundaries of how we interact with digital information and the physical world