Professors receive NSF grant for deep-learning model that can customize microarchitecture based on specific needs.
ROHM’s New PWM Controller ICs with SOP Package for Power Supplies in a Wide Variety of Industrial Applications
ROHM Semiconductor today announced new external FET-type controller ICs utilizing PWM current control mode optimized for AC-DC power supplies in various industrial applications.
Silicon Labs and Kudelski IoT Partner to Accelerate Matter Device Certification
Silicon Labs, in partnership with Kudelski IoT, a division of the Kudelski Group, today announced a new solution to accelerate the time to market for Matter-certified IoT devices.
Iridium to Collaborate with Nordic Semiconductor on Iridium NTN Direct integration
Iridium Communications Inc. (NASDAQ: IRDM), a provider of global voice and data satellite communications, today announced its collaboration with Nordic Semiconductor for early integration of its Iridium NTN Direct service into Nordic’s LTE-M/NB-IoT modules and chipsets.
Quantum Register Reaches 1200 Neutral Atoms in Continuous Operation
A Munich Quantum Valley (MQV) research team, led by the Max Planck Institute of Quantum Optics (MPQ) in collaboration with the quantum computing start-up planqc, has succeeded in running a register of 1200 atoms continuously for over an hour – a breakthrough on the way to scalable quantum computers.
2024 IEEE IEDM Spotlights Advances in Critical Semiconductor Technologies
Since it began in 1955, the IEEE International Electron Devices Meeting (IEDM) has been where the world’s best and brightest electronics technologists go to learn about the latest breakthroughs in semiconductor and related technologies.
Accelerating Clean Energy Adoption in Singapore’s Semiconductor Industry
Roundtable hosted by SEMI and the Asia Clean Energy Coalition.
Terecircuits Unveils New Bonding Material for Next-Generation Advanced Packaging
Terecircuits Corporation, a venture-backed startup in advanced materials for the semiconductor industry, today introduced Terefilm, a patented material designed for temporary bonding and debonding applications in advanced packaging.
Northeast Microelectronics Coalition Hub Awards More Than $1 Million to Advance Microelectronic Innovation
First-of-its-kind program awards startups and small businesses with funding to develop next-gen microelectronics technologies.
Stephen DiFranco Joins Rapidus Design Solutions as Head of Marketing and Partnerships
Rapidus Design Solutions today announced Stephen DiFranco as its new head of marketing and ecosystem partnerships.
