SIA-BCG study calls for new federal funds to be directed at five key areas of semiconductor R&D.
Novel Thin and Flexible Sensor Characterizes High-speed Airflows on Curved Surfaces
The multidirectional sensor developed by researchers from Japan can help improve the efficiencies of industrial-scale fluid machinery.
Micron and Governor Hochul Welcome President Biden to Central New York
Micron Technology, Inc. and Governor Kathy Hochul welcome President Joe Biden and other federal, state and local officials to Central New York where Micron plans to invest up to $100 billion over the next 20-plus years to build a leading-edge memory megafab.
AI-ALOE Brings AI-based Ecological Research Power To Local Technical College
During the summer, Duncan Hughes, an Environmental Technology instructor at North Georgia Technical College (NGTC) introduced his students to the web application Virtual Ecological Research Assistant, better known as VERA.
Cadence’s New Flow Automates Custom/Analog Design Migration on TSMC Advanced Technologies
Cadence Design Systems, Inc.collaborated with TSMC to develop a node-to-node design migration flow built upon the Cadence Virtuoso design platform for custom/analog IC blocks that use TSMC’s advanced process technologies.
Kioxia and Western Digital Celebrate the Opening of Fab7 at Yokkaichi, Japan
Kioxia Corporation and Western Digital Corporation today celebrated the opening of the semiconductor fabrication facility, Fab7, at the Yokkaichi Plant in Mie Prefecture, Japan.
Synopsys Collaborates with TSMC
Addressing complex customer requirements for heterogeneous compute-intensive applications, Synopsys, Inc. today announced the availability of the industry’s most comprehensive EDA and IP solutions for 2D/2.5D/3D multi-die systems for TSMC’s most advanced N7, N5 and N3 process technologies.
Alchip Technologies Joins UCIe Consortium
Alchip Technologies has joined the UCIe (Universal Chiplet Interconnect Express) Consortium at the contributor level, reinforcing its position as the high-performance ASIC leader.
Worldwide Silicon Wafer Shipments Set a New Record in Q3 2022, SEMI Reports
Worldwide silicon wafer shipments reached a new record of 3,741 million square inches (MSI) in the third quarter of 2022, increasing 1.0% quarter-over-quarter and growing 2.5% from the 3,649 MSI recorded during the same quarter last year.
Supplyframe and Jabil Indicate Limited Relief for the Electronics Supply Chain
Industry leaders make meaning out of mixed signals, myriad disruptions to illuminate the best path forward.
