Shannon Davis

News and Web Editor

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Shannon, writes, edits and produces Semiconductor Digest’s news articles, email newsletters, blogs, webcasts, and social media posts. She holds a bachelor’s degree in journalism from Huntington University in Huntington, IN. In addition to her years of freelance business reporting, Shannon has also worked in marketing and public relations in the renewable energy and healthcare industries.

Micron Announces Historic Investment of up to $100 Billion to Build Megafab in Central New York

Sustainably built and operated, leading-edge memory fab to create nearly 50,000 New York jobs; New Green CHIPS Community Fund to invest $500 million in community and workforce development over time

CHIPS Act Benefits Rolling Out for Material Companies

Tips for making the most out of government benefits for US semiconductor growth.

Promex Expands Die Bonding Capacity, Adds New Capabilities

Promex Industries, a Silicon Valley-based provider of advanced design, packaging and microelectronics assembly services, today announced it has completed the first phase of its plan to expand its die bonding services.

European Semiconductor Manufacturer SweGaN Secures 12M Euro Investment

SweGaN AB, manufacturer of custom-made Gallium Nitride on Silicon Carbide (GaN-on-SiC) epitaxial wafers for an extensive range of devices used in telecom, satellite, defense, and power electronics, announces it has completed a Series A financing round totaling 125 MSEK (12M Euro).

Synopsys and Samsung Foundry Enable 3nm Process Technology for Power- and Performance-Demanding Mobile, HPC and AI Designs

Synopsys, Inc. today announced that its longstanding collaboration with Samsung Foundry has produced multiple successful test chip tapeouts on Synopsys digital and custom design tools and flows, certified for Samsung Foundry’s most advanced process.

SEMIFIVE Announces New 5nm HPC SoC Platform

SEMIFIVE, a design solution provider and pioneer of platform-based custom silicon solutions, today revealed its latest SoC Platform targeting high performance compute (HPC) applications.

Miniaturized, Energy Efficient, and Faster Than Silicon: This New Computer Chip Is Ideal for AI

Artificial intelligence presents a major challenge to conventional computing architecture. In standard models, memory storage and computing take place in different parts of the machine, and data must move from its area of storage to a CPU or GPU for processing.

Mark Templeton Inducted into Phil Kaufman Hall of Fame by the ESD Alliance and IEEE CEDA

Mark Templeton, the former managing director of investment firm Scientific Ventures, and a Lanza techVentures investment partner and board member, today was inducted posthumously into the Phil Kaufman Hall of Fame.

POSi Energy – Silicon Power Announces Breakthrough in Anode Development for Lithium-ion Batteries

Today, POSi Energy – Silicon Power, announced the demonstration of a new lithium-silicon anode that allows a revolutionary performance step-up in lithium-ion batteries.

KLA Announces Plans to Build a New R&D and Manufacturing Facility in Newport, Wales

KLA Corporation has announced plans to build a new research-and-development (R&D) and manufacturing center for the SPTS division, in Newport, Wales, UK.