TESCAN ORSAY HOLDING a.s. today announced the revolutionary new TENSOR―the first 4D-scanning transmission electron microscope (4D-STEM) built from the ground up for a totally new level of performance and user experience.
Weebit Nano Receives from SkyWater Technology the First Silicon Wafers it Manufactured with Embedded Weebit ReRAM
Weebit Nano Limited and SkyWater Technology announce the first silicon wafers integrating Weebit’s embedded Resistive Random-Access Memory (ReRAM) module have been delivered to Weebit from SkyWater’s U.S. production fab.
GSA Announces 2022 Award Nominees
The prestigious awards will be presented at GSA’s Awards Celebration on Thursday, Dec. 8, 2022.
Fab Expansions in Europe Impact Materials Supply Chain
TECHCET anticipates increased strain on European chemical availability as semiconductor fabrication companies continue to expand in the region.
Global Silicon Wafer Shipments Projected to Set New Record in 2022, SEMI Reports
Global silicon wafer shipments are projected to increase 4.8% year-over-year in 2022 to a record high of nearly 14,700 millions of square inches (MSI), SEMI reported today in its annual silicon shipment forecast for the semiconductor industry.
EV Group Advances Leadership in Optical Lithography with Next-Generation EVG150 Resist Processing Platform
Redesigned 200mm platform increases module capacity for higher throughput, improves architecture for reduced tool footprint all while maintaining industry-leading capabilities of previous-generation platform.
SEMICON Europa 2022 Keynotes to Highlight Chip Industry Growth Opportunities and Advanced Technologies
Registration for the event, co-located with electronica, is now open.
Semiconductor Climate Consortium Representatives to Present During 2022 United Nations Climate Change Conference (COP27)
SEMI today announced that members of the new Semiconductor Climate Consortium (SCC) will discuss key aspects of the group’s vision, goals and membership at two sessions during COP27 in Sharm El-Sheik, Egypt.
Samsung Electronics Begins Mass Production of 8th-Gen Vertical NAND with Industry’s Highest Bit Density
Samsung Electronics Co., Ltd., as promised at Flash Memory Summit 2022 and Samsung Memory Tech Day 2022, announced today that it has begun mass producing a 1-terabit (Tb) triple-level cell (TLC) eighth-generation Vertical NAND (V-NAND) with the industry’s highest bit density.
Aehr Receives Over $4 Million in Orders for its FOX WaferPak Full Wafer Contactors
These WaferPak Contactors are expected to ship by the end of Aehr’s fiscal third quarter ending February 28, 2023.
