Company expands the 300mm product line with new semi-automated system.
Nexperia Introduces New High Speed Optimized Flip-Chip Package Technology
New flip-chip land grid array (FC-LGA) packages deliver superior RF performance and meet automotive quality with industry’s first side-wettable flank versions.
Cyient Announces the Launch of Semiconductor Subsidiary
By carrying forward Cyient’s expertise in semiconductor design, Cyient Semiconductors will focus on scaling Application-Specific Integrated Circuit (ASIC) turnkey solutions for customers.
Omnitron Sensors Appoints Ijaz Jafri as Vice President of Engineering
Dr. Jafri brings a 20+-year track record of successfully bringing disruptive MEMS and semiconductor technologies to market in the automotive, industrial, aerospace, defense and consumer sectors.
Nanomotion Delivers First Prototype for .25 Nanometer Resolution Stage for Semiconductor Metrology
Nanomotion, a provider of advanced motion solutions, announced the successful delivery of its first prototype for a .25nm resolution stage designed for semiconductor metrology applications.
AUO Showcases Diverse Display Solutions Driven by Revolutionary Display Technology at Touch Taiwan
Under the theme “Beyond Vision – Create the Ultimate,” AUO will showcase advanced technology at Touch Taiwan 2025, the annual gala for the display industry, taking place at the Taipei Nangang Exhibition Center April 16-18, 2025.
Hailo Selects Avnet ASIC as Channel Partner for TSMC Silicon Production
Avnet ASIC announced that it has been selected by Hailo, a chipmaker of edge artificial intelligence (AI) processors, as its silicon channel partner for future chips on its product roadmap.
SEALSQ Appoints COO to Spearhead Its North American Operations
SEALSQ Corp, a company that focuses on developing and selling Semiconductors, PKI, and Post-Quantum technology hardware and software products, announced today the appointment of Loïc Hamon as its Chief Operating Officer (COO), as part of the Company’s strategic expansion in the North American market, effective immediately.
Inaugural SEMIEXPO Heartland Event Underscores Midwestern U.S. as a Global Hub for Smart Manufacturing and Smart Mobility
The inaugural SEMIEXPO Heartland event welcomed leaders in smart mobility and smart manufacturing to the Indiana Convention Center to explore opportunities for collaboration across both disciplines.
AMD Completes Acquisition of ZT Systems
AMD today announced the completion of its acquisition of ZT Systems, a provider of AI and general-purpose compute infrastructure for the world’s largest hyperscale providers.
