Linköping University is coordinating TAILOR, a EU project that has drawn up a research-based roadmap intended to guide research funding bodies and decision-makers towards the trustworthy AI of the future.
Research Reveals Quantitative and High-Resolution Pressure Functions of Pressure-Sensitive Material
Researchers from Nagoya University in central Japan have published a study in the Journal of Materials Chemistry on a pressure-sensitive material, known as fluorenylidene-acridane (FA). Their research has potential applications for technologies related to pressure sensing, recording, and display devices.
Industry Well Represented on New U.S. Government Advisory Committee on Microelectronics Industry
Two of the electronics industry’s most far-sighted and innovative leaders have been named to the U.S. Department of Commerce’s new Industrial Advisory Committee (IAC), which will provide guidance to the Secretary of Commerce on a range of issues related to CHIPS for America Act programs.
Discovery of New Nanowire Assembly Process Could Enable More Powerful Computer Chips
In a newly-published study, a team of researchers in Oxford University’s Department of Materials led by Harish Bhaskaran, Professor of Applied Nanomaterials, describe a breakthrough approach to pick up single nanowires from the growth substrate and place them on virtually any platform with sub-micron accuracy.
Improving Wearable Medical Sensors With Ultrathin Mesh
On-skin medical sensors and wearable health devices are important health care tools that must be incredibly flexible and ultrathin so they can move with the human body.
NAND Flash Prices Expected to Plummet 15-20% in Q4
Utmel, a professional electronic component distributor, informs buyers that NAND flash prices are expected to fall 15-20% in Q4.
Saras Micro Devices Selects Technology Manufacturing Site in Arizona
Saras Micro Devices has selected a site in the Price Corridor in Chandler, AZ to build out a manufacturing facility for its advanced power delivery solutions.
Automotive IC Marketshare Seen Rising to 10% by 2026
Automotive IC sales expected to post average annual growth of 13.4%; Communications and Computer segments remain largest applications.
StratEdge Packaging and Assembly Services Expands for High-Frequency and High-Power Devices
Technical experts available at BCICTS 2022 and IMAPS 2022 to discuss packaging applications.
onsemi Launches Automotive Silicon Carbide-Based Power Module Trio for On-Board Chargers
onsemi today announced a trio of silicon carbide (SiC) based power modules in transfer molded technology that are intended for use in on-board charging and high voltage (HV) DCDC conversion within all types of electric vehicles (xEV).
