Researchers experimentally demonstrate the first fully connected annealing processor that can be scaled up across multiple chips.
ACM Research Launches New Furnace Tool for Thermal Atomic Layer Deposition to Support Advanced Semiconductor Manufacturing Requirements
ACM Research, Inc., a supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) applications, today announced that it has expanded its 300mm Ultra Fn furnace dry processing platform with the introduction of its Ultra Fn A furnace tool.
Dr. Giovanni De Micheli Honored with 2022 Phil Kaufman Award Presented by ESD Alliance and IEEE CEDA
EPFL and former Stanford professor recognized for his significant impact on the electronic system design industry through pioneering technical contributions.
eBeam Initiative Survey Reports EUV Fueling Photomask Industry Growth
Results of 11th annual Luminaries survey to be presented at live event held during SPIE Photomask Technology + EUV Lithography Conference.
Nearly $11M in Addtional DOD Funds Expands Purdue-led Microelectronics Workforce Program
Five-year extension of SCALE workforce initiative aims to restore global lead through education initiatives.
Synopsys Advances Silicon Lifecycle Management to Accelerate Data Transport and Significantly Reduce Test Time
Enabling real-time analytics for silicon health monitoring of increasingly large, complex designs, Synopsys, Inc. today announced an innovative streaming fabric technology that shortens both silicon data access and test time by up to 80% while also minimizing excessive power.
Global Fab Equipment Spending Forecast to Reach All-Time High of Nearly $100 Billion in 2022
Global fab equipment spending for front-end facilities is expected to increase approximately 9% year-over-year (YOY) to a new all-time high of US$99 billion in 2022.
SEMI and AVCC Team to Promote Autonomous Vehicle Innovation and Mass Market Adoption
The Autonomous Vehicle Computing Consortium and SEMI announced today an alliance to drive autonomous vehicle innovation.
New Nanocomposite Films Boost Heat Dissipation in Thin Electronics
Scientists from Japan developed cellulose nanofiber-carbon fiber composite films with high in-plane heat conductivity to assist in heat dissipation.
GOWIN Semiconductor New 22nm High-Performance FPGA Family
GOWIN Semiconductor Corporation, the world’s fastest growing FPGA company, announces today the release of its new generation Arora V high performance FPGA family.
