Price volatility in chemicals used for semiconductors further strains market.
Siemens Automates 2.5D and 3D IC Design-for-Test with New Tessent Multi-Die Solution
Siemens Digital Industries Software today introduced the Tessent Multi-die software solution, which helps customers dramatically speed and simplify critical design-for-test (DFT) tasks for next-generation integrated circuits (ICs) based on 2.5D and 3D architectures.
SABIC Names Conventus Polymers as New Distribution Partner for Specialty Thermoplastics in North America
SABIC has named Conventus Polymers, LLC, as an authorized distributor of high-performance engineering thermoplastics in the United States, Canada and Mexico.
Nordson Corporation Appoints Anand Patel as Vice President, Treasury and Finance
Nordson Corporation announced that Anand Patel will succeed Ray Cushing as vice president, treasury and finance following Ray’s upcoming retirement.
Science, Tech, and AI Leaders Convene to Launch Kempner Institute
CZI co-founders and co-CEOs Mark Zuckerberg and Priscilla Chan and President of Harvard University Lawrence Bacow commemorate new research institute to study natural and artificial intelligence.
Defense Strategies Institute Announces 2022 Assured Microelectronics Summit Agenda
Defense Strategies Institute is pleased to announce the agenda for the 2022 Assured Microelectronics Summit is now available.
Imec Researchers Work to Debut Key Building Block for the Deployment of 100G PON Networks
Presenting world’s first upstream 100 Gbit/s PAM-4 linear burst-mode transimpedance amplifier (TIA) chip for the roll-out of next-generation flexible PONs.
The Semiconductor Market’s Slowdown Picks Up Speed
The second quarter of 2022 was the third consecutive quarter of weakening revenue growth for the semiconductor market, with the market now in decline according to Omdia’s Competitive Landscape Tracker.
Rockley Photonics Unveils Next-Generation, Higher-Density Laser Spectrophotometer Chip for Wearable Health Monitoring
Groundbreaking achievement in micro-transfer printing increases density of Rockley’s silicon-photonics-based integrated lasers beyond previous levels.
Gwangju Institute of Science and Technology Researchers Design Durable Organic Semiconductor Photocathodes with Metal Foil Encapsulation
With this approach, the developed photocathodes exhibit a remarkable stability and demonstrate sunlight-driven clean hydrogen production by water splitting.
