SEMI, the industry association serving the global electronics design and manufacturing supply chain, today applauded the progress on the European Chips Act by the European Council, expressing strong support for the swift start of the negotiations in 2023.
Lattice Semiconductor Appoints Douglas Bettinger to Board of Directors
Lattice Semiconductor, the low power programmable leader, today announced the appointment of Douglas Bettinger to the Company’s Board of Directors and Audit Committee effective December 2, 2022.
The MOSIS Service of the USC Information Sciences Institute and SkyWater Collaborate on Silicon IC Design Enablement and Manufacturing Service
The MOSIS Service will provide multi-project wafer (MPW) shuttle access to SkyWater’s S90 and S130 mixed-signal CMOS technologies.
Global Semiconductor Equipment Billings Increase 9% in Q3 2022, SEMI Reports
Global semiconductor equipment billings rose 9% from the second to the third quarter of 2022 and 7% year-over-year to US$28.75 billion, SEMI announced today.
STMicroelectronics and Soitec Cooperate on SiC Substrate Manufacturing Technology
STMicroelectronics and Soitec announce the next stage of their cooperation on Silicon Carbide (SiC) substrates, with the qualification of Soitec’s SiC substrate technology by ST planned over the next 18 months.
Making Sense of Coercivity in Magnetic Materials with Machine Learning
Scientists develop a meaningful approach to analyze how a material’s microstructure relates to its macroscopic physical properties.
Synopsys Appoints Shelagh Glaser Chief Financial Officer
Synopsys, Inc. today announced that it has appointed Shelagh Glaser as chief financial officer, effective December 2, 2022.
High Purity T-342 Diaphragm Valve Now Includes Sanitary Adapters Option
Asahi/America, Inc. now offers its T-342 diaphragm valves with optional sanitary adapter end connectors.
Henkel Non-Conductive Die Attach Film Offers Broad Wirebond Package Flexibility
Henkel today announced the commercialization of a high-performance non-conductive die attach film (ncDAF) engineered to address the demands of contemporary packaging device designs.
CVD Deposition, Plating and Sputter Target Materials Looking Strong Despite Threat of Semiconductor Market Slowdown
Advanced packaging and interconnect layers driving growth through ‘26.
