OMNIVISION today debuted its OX12A10 12-megapixel (MP)-resolution CMOS image sensor with TheiaCel technology at AutoSens Europe 2024.
Samsung Starts Mass Production of Industry’s Most Powerful PC SSD Optimal for AI Applications
Samsung Electronics today announced it has begun mass producing PM9E1, a PCle 5.0 SSD with the industry’s highest performance and largest capacity.
RTX to Develop Ultra-Wide Bandgap Semiconductors for DARPA
New class of materials offer improved conductivity and thermal management properties.
Rapidus Establishes Back-End Semiconductor Manufacturing Process Research-and-Development Center
Rapidus Corporation, a company involved in the research, development, design, manufacture and sales of advanced logic semiconductors, today announced that it will set up a clean room within Seiko Epson Corporation’s facility in Chitose, Hokkaido, and open a research-and-development (R&D) center for semiconductor post-processing called Rapidus Chiplet Solutions (RCS).
Jabil Acquires Mikros Technologies
Jabil Inc. today announced the successful acquisition of Mikros Technologies LLC, a leader in the engineering and manufacturing of liquid cooling solutions for thermal management, completed October 1.
MIT Engineers Create a Chip-Based Tractor Beam for Biological Particles
The tiny device uses a tightly focused beam of light to capture and manipulate cells.
SWAP Hub Project Led by Idaho Scientific and Partners Awarded CHIPS Funding to Revolutionize IoT Security
The Southwest Advanced Prototyping (SWAP) Hub, based at Arizona State University, has been awarded nearly $7.8 million in funding by the CHIPS and Science Act for an innovative project led by Idaho Scientific to develop the ARC-V Secure Processor.
TXOne Networks Expands Edge Series of OT-Native Network Security Appliances
The product family is supercharged with new models and a powerful firmware upgrade.
Empower Debuts Revolutionary AI Power Delivery Platform to Solve Critical Technology Roadblock
Empower Semiconductor today unveiled the Crescendo vertical power delivery platform to address the growing power demands of artificial intelligence (AI) and high-performance computing (HPC) applications.
ZEISS Microscopy Opens Semiconductor Applications Laboratory in Dresden
ZEISS has announced it recently opened the ZEISS Microscopy semiconductor applications lab in Dresden.
