STMicroelectronics will build an integrated Silicon Carbide (SiC) substrate manufacturing facility in Italy to support the increasing demand from ST’s customers for SiC devices across automotive and industrial applications as they transition to electrification and seek higher efficiency.
Quantum-Si Appoints Jeff Hawkins as Chief Executive Officer
Quantum-Si Incorporated, a life sciences company commercializing the first next-generation single-molecule protein sequencing platform, today announced the appointment of Jeff Hawkins as Chief Executive Officer.
Samsung Electronics Unveils Plans for 1.4nm Process Technology and Investment for Production Capacity at Samsung Foundry Forum 2022
Samsung Electronics announced today a strengthened business strategy for its Foundry Business with the introduction of cutting-edge technologies at its annual Samsung Foundry Forum event.
Materion Announces $20M in Investments in Massachusetts Facility to Expand Capacity for the Semiconductor Industry
Materion Corporation announced today that it is investing more than $20 Million in its recently acquired Newton, Massachusetts facility.
Micron Announces Historic Investment of up to $100 Billion to Build Megafab in Central New York
Sustainably built and operated, leading-edge memory fab to create nearly 50,000 New York jobs; New Green CHIPS Community Fund to invest $500 million in community and workforce development over time
CHIPS Act Benefits Rolling Out for Material Companies
Tips for making the most out of government benefits for US semiconductor growth.
Promex Expands Die Bonding Capacity, Adds New Capabilities
Promex Industries, a Silicon Valley-based provider of advanced design, packaging and microelectronics assembly services, today announced it has completed the first phase of its plan to expand its die bonding services.
European Semiconductor Manufacturer SweGaN Secures 12M Euro Investment
SweGaN AB, manufacturer of custom-made Gallium Nitride on Silicon Carbide (GaN-on-SiC) epitaxial wafers for an extensive range of devices used in telecom, satellite, defense, and power electronics, announces it has completed a Series A financing round totaling 125 MSEK (12M Euro).
Synopsys and Samsung Foundry Enable 3nm Process Technology for Power- and Performance-Demanding Mobile, HPC and AI Designs
Synopsys, Inc. today announced that its longstanding collaboration with Samsung Foundry has produced multiple successful test chip tapeouts on Synopsys digital and custom design tools and flows, certified for Samsung Foundry’s most advanced process.
SEMIFIVE Announces New 5nm HPC SoC Platform
SEMIFIVE, a design solution provider and pioneer of platform-based custom silicon solutions, today revealed its latest SoC Platform targeting high performance compute (HPC) applications.
