Artificial intelligence presents a major challenge to conventional computing architecture. In standard models, memory storage and computing take place in different parts of the machine, and data must move from its area of storage to a CPU or GPU for processing.
Mark Templeton Inducted into Phil Kaufman Hall of Fame by the ESD Alliance and IEEE CEDA
Mark Templeton, the former managing director of investment firm Scientific Ventures, and a Lanza techVentures investment partner and board member, today was inducted posthumously into the Phil Kaufman Hall of Fame.
POSi Energy – Silicon Power Announces Breakthrough in Anode Development for Lithium-ion Batteries
Today, POSi Energy – Silicon Power, announced the demonstration of a new lithium-silicon anode that allows a revolutionary performance step-up in lithium-ion batteries.
KLA Announces Plans to Build a New R&D and Manufacturing Facility in Newport, Wales
KLA Corporation has announced plans to build a new research-and-development (R&D) and manufacturing center for the SPTS division, in Newport, Wales, UK.
The Road to Future AI Is Paved with Trust
Linköping University is coordinating TAILOR, a EU project that has drawn up a research-based roadmap intended to guide research funding bodies and decision-makers towards the trustworthy AI of the future.
Research Reveals Quantitative and High-Resolution Pressure Functions of Pressure-Sensitive Material
Researchers from Nagoya University in central Japan have published a study in the Journal of Materials Chemistry on a pressure-sensitive material, known as fluorenylidene-acridane (FA). Their research has potential applications for technologies related to pressure sensing, recording, and display devices.
Industry Well Represented on New U.S. Government Advisory Committee on Microelectronics Industry
Two of the electronics industry’s most far-sighted and innovative leaders have been named to the U.S. Department of Commerce’s new Industrial Advisory Committee (IAC), which will provide guidance to the Secretary of Commerce on a range of issues related to CHIPS for America Act programs.
Discovery of New Nanowire Assembly Process Could Enable More Powerful Computer Chips
In a newly-published study, a team of researchers in Oxford University’s Department of Materials led by Harish Bhaskaran, Professor of Applied Nanomaterials, describe a breakthrough approach to pick up single nanowires from the growth substrate and place them on virtually any platform with sub-micron accuracy.
Improving Wearable Medical Sensors With Ultrathin Mesh
On-skin medical sensors and wearable health devices are important health care tools that must be incredibly flexible and ultrathin so they can move with the human body.
NAND Flash Prices Expected to Plummet 15-20% in Q4
Utmel, a professional electronic component distributor, informs buyers that NAND flash prices are expected to fall 15-20% in Q4.
