Saras Micro Devices has selected a site in the Price Corridor in Chandler, AZ to build out a manufacturing facility for its advanced power delivery solutions.
Automotive IC Marketshare Seen Rising to 10% by 2026
Automotive IC sales expected to post average annual growth of 13.4%; Communications and Computer segments remain largest applications.
StratEdge Packaging and Assembly Services Expands for High-Frequency and High-Power Devices
Technical experts available at BCICTS 2022 and IMAPS 2022 to discuss packaging applications.
onsemi Launches Automotive Silicon Carbide-Based Power Module Trio for On-Board Chargers
onsemi today announced a trio of silicon carbide (SiC) based power modules in transfer molded technology that are intended for use in on-board charging and high voltage (HV) DCDC conversion within all types of electric vehicles (xEV).
Scalable and Fully Coupled Quantum-inspired Processor Solves Optimization Problems
Researchers experimentally demonstrate the first fully connected annealing processor that can be scaled up across multiple chips.
ACM Research Launches New Furnace Tool for Thermal Atomic Layer Deposition to Support Advanced Semiconductor Manufacturing Requirements
ACM Research, Inc., a supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) applications, today announced that it has expanded its 300mm Ultra Fn furnace dry processing platform with the introduction of its Ultra Fn A furnace tool.
Dr. Giovanni De Micheli Honored with 2022 Phil Kaufman Award Presented by ESD Alliance and IEEE CEDA
EPFL and former Stanford professor recognized for his significant impact on the electronic system design industry through pioneering technical contributions.
eBeam Initiative Survey Reports EUV Fueling Photomask Industry Growth
Results of 11th annual Luminaries survey to be presented at live event held during SPIE Photomask Technology + EUV Lithography Conference.
Nearly $11M in Addtional DOD Funds Expands Purdue-led Microelectronics Workforce Program
Five-year extension of SCALE workforce initiative aims to restore global lead through education initiatives.
Synopsys Advances Silicon Lifecycle Management to Accelerate Data Transport and Significantly Reduce Test Time
Enabling real-time analytics for silicon health monitoring of increasingly large, complex designs, Synopsys, Inc. today announced an innovative streaming fabric technology that shortens both silicon data access and test time by up to 80% while also minimizing excessive power.