According to TrendForce research, Intel plans to outsource the tGPU chipset in Meteor Lake to TSMC for manufacture.
SkyWater Joins the American Semiconductor Innovation Coalition
Industry consortium proposes solutions for the National Semiconductor Technology Center and the National Advanced Packaging Manufacturing Program requested in the CHIPS+ Act.
IC Sales Turn Negative as Economy Weighs on Market
Never-before seen decline in June IC market driven by steep drop in memory pricing.
Smart Microrobots Learn How to Swim and Navigate with Artificial Intelligence
The AI-powered swimmer is able to switch between different locomotory gaits adaptively to navigate toward any target location on its own.
InnovationLab Demonstrates Breakthrough PCB Production Method Based on Additive Manufacturing
InnovationLab, the expert in printed electronics “from lab to fab”, announces it has achieved a breakthrough in additive manufacturing of printed circuit boards (PCBs), helping meet higher environmental standards for electronics production while also reducing costs.
US/China Tension Must Be Seen in the Context of Taiwan’s TSMC’s Critical Role in the Global Semi Supply Chain
Following the news of raising tension between the US and China as a result of US House Speaker Nancy Pelosi recent visit to Taiwan; Josep Bori, Research Director in the Thematic team at GlobalData, a leading data and analytics company, offers his view.
Lip-Bu Tan, Executive Chairman of Cadence Design Systems and Chairman of Walden International, to Receive Semiconductor Industry’s Top Honor
Tan, renowned tech visionary and venture capital pioneer, will accept 2022 Robert N. Noyce Award during SIA Awards Dinner on Nov. 17.
SK hynix Develops World’s Highest 238-Layer 4D NAND Flash
SK hynix Inc. announced today that it has developed the industry’s highest 238-layer NAND Flash product.
Kioxia Launches Second Generation of High-Performance, Cost-Effective XL-FLASH Storage Class Memory Solution
Kioxia Corporation today announced the launch of the second generation of XL-FLASH, a Storage Class Memory (SCM) solution based on its BiCS FLASH 3D flash memory technology, which significantly reduces bit cost while providing high performance and low latency.
SEMI MEMS & Imaging Sensors Summit to Highlight Innovation, Industry Growth and Workforce Diversity
More than 400 industry experts will gather for insights into the latest technology developments and trends across the MEMS and sensors supply chain at SEMI MEMS & Imaging Sensors Summit, 6-7 September, 2022 at the World Trade Center (WTC) in Grenoble, France.
