A tropical storm, remnants of Hurricane Helene, ripped through the western North Carolina mountain town of Spruce Pine last week, disrupting quartz supply operations at both Sibelco and The Quartz Corp.
DENSO and ROHM Agree to Start Consideration of Strategic Partnership in the Semiconductor Field
DENSO CORPORATION and ROHM Co., Ltd. announced that the two companies have agreed to start consideration of strategic partnership in the semiconductor field.
BrainChip Introduces Lowest-Power AI Acceleration Co-Processor
BrainChip Holdings Ltd today introduced the Akida Pico, the lowest power acceleration co-processor that enables the creation of very compact, ultra-low power, portable and intelligent devices for wearable and sensor integrated AI into consumer, healthcare, IoT, defense and wake-up applications.
eBeam Initiative Survey of Semiconductor Luminaries Predicts Photomask Market Growth and Increasing Investments in Mask Inspection and Multi-beam Mask Writing
Results of 13th annual Luminaries survey to be presented at live event held during SPIE Photomask Technology + EUV Lithography Conference.
Global Semiconductor Packaging Material Market Outlook Shows Return to Growth Starting in 2024
Powered by strong semiconductor demand across diverse end applications, the global semiconductor packaging materials market is expected to start a growth cycle with a 5.6% compound annual growth rate (CAGR) projected through 2028.
Georgia Tech to Use ClassOne Technology Solstice S8 Single-Wafer Wet Processing System for Advanced Packaging R&D
ClassOne to support establishment of 3D heterogeneous integration hub at Georgia Tech’s Institute for Matter and Systems
ASM Launches PE2O8 Silicon Carbide Epitaxy System
Today at the 2024 International Conference on Silicon Carbide and Related Materials, ASM International N.V. (Euronext Amsterdam: ASM) introduced the PE2O8 silicon carbide epitaxy system, a new, dual chamber, platform for silicon carbide (SiC) epitaxy (Epi).
RIBER Receives Order to Equip Autonomous Pilot Line for the Design and Manufacturing of Optical Devices in Europe
RIBER is announcing the sale of a fully automated MBE 412 cluster platform in Finland.
SWAP Hub Team Awarded CHIPS Act Funded Project
The Deptartment of Defense has announced that the Southwest Advanced Prototyping (SWAP) Hub based at Arizona State University (ASU) has been awarded $5M in funding by the CHIPS and Science Act for a Multi-MHz, High Density, Ultra-fast RADAR Power Convert project that will advance radar power systems in critical defense applications.
SEMI Consortium to Develop Cybersecurity Strategy and Roadmap for the Semiconductor Industry in NIST Framework
Seeking to strengthen the semiconductor industry’s resilience to cybersecurity threats, the global association SEMI today announced the creation of a strategic roadmap for cybersecurity implementation throughout the industry.
