Palomar Technologies announced the consignment of an SST 5100 Vacuum Reflow Furnace at the Electronics and Photonics Innovation Centre (EPIC) in Paignton, UK.
LEGO Stacking of 2D Materials Brings Us a Step Closer to Ultracompact Memory and Spintronic Technology
SUTD scientists designed a novel functional 2D hybrid material for ultracompact memory and spintronic device applications.
Siemens and NVIDIA to Enable Industrial Metaverse
Siemens and NVIDIA today announced an expansion of their partnership to enable the industrial metaverse and increase use of AI-driven digital twin technology that will help bring industrial automation to a new level.
Weebit Nano Tapes Out ReRAM Demo Chip to SkyWater Foundry
Weebit Nano Limited, a developer of next-generation memory technologies for the global semiconductor industry, announced it has taped-out (released to manufacturing) demonstration chips integrating its embedded Resistive Random-Access Memory (ReRAM) module to SkyWater Technology’s foundry.
Flex Logix and CEVA Announce First Working Silicon of a DSP with Embedded FPGA to Allow a Flexible/Changeable ISA
Flex Logix EFLX embedded FPGA brings reconfigurable computing to CEVA-X2 DSP instruction extension to support demanding and changing workloads.
Lam Research Outlines Path, Progress to Net Zero Emissions
Semiconductor industry leader releases annual environmental, social and governance report, and unveils new program to empower social impact.
SiFive Expands Global Operations, Opens UK R&D Center in Cambridge
SiFive, Inc., the founder and leader of RISC-V computing, today announced the opening of its new UK Research & Development (R&D) Center headquartered in Cambridge, United Kingdom.
Micron Delivers Industry’s First 176-Layer NAND SATA SSD for Data Centers
Micron Technology, Inc. today announced it is shipping the world’s first 176-layer NAND SATA SSD designed for data center workloads.
Anari AI Launched Thor X – the First “System-on-Cloud” for Processing 3D Point Clouds
A new Cloud-based technology “System-on-Cloud”, developed by the Anari AI team, introduces an optimized and efficient system from various different hardware and software architectures combined with machine learning models to revolutionize the way AI compute systems are utilized.
Purdue University Partners with Leading Global Chipmaker on Midwest’s First Semiconductor Design Center
Purdue University’s College of Engineering is partnering with MediaTek Inc., a global fabless chipmaker, to open the Midwest’s first semiconductor chip design center, to be housed on Purdue’s campus.
