Mitsubishi Electric US, Inc. recently launched a new Silicon Carbide (SiC) power module FMF400DY-24B.
RISC-V Summit China 2022 Announces Call for Papers
The Summit will showcase the continued rapid expansion of the RISC-V ecosystem, with both commercial offerings and exciting open-source developments.
Global Embedded Die Packaging Technology Market to Generate $311.41 Million by 2030
Increase in requirement for miniaturization of electronic circuits in microelectronic devices drives the growth of the global embedded die packaging technology market.
Supplyframe to Showcase Supply Chain Resiliency at the Gartner Supply Chain Symposium/Xpo 2022
Supplyframe today announced that the company will participate in the Gartner Supply Chain Symposium/Xpo, being held June 6-8, 2022, at the Walt Disney World Dolphin Resort in Orlando.
CEA-Leti & Intel Report Die-to-Wafer Self-Assembly Breakthrough Targeting High Alignment Accuracy and Throughput
In a breakthrough for the future of die-to-wafer (D2W) bonding, CEA-Leti and Intel have optimized a hybrid direct-bonding, self-assembly process that has the potential to increase the alignment accuracy as well as fabrication throughput by several thousand dies per hour.
ClassOne Technology and Fraunhofer ENAS to Collaborate on Hybrid Bonding for Advanced Imaging Devices
Partnership will leverage firms’ respective heterogeneous-integration proficiencies to focus on development and optimization of full process-integration schemes for diverse high-density pixel array applications.
Global Semiconductor Equipment Billings Grow 5% Year-Over-Year in Q1 2022, SEMI Reports
Global semiconductor equipment billings grew 5% year-over-year to US$24.7 billion in the first quarter of 2022, SEMI announced today in its Worldwide Semiconductor Equipment Market Statistics (WWSEMS) Report.
Kioxia to Complete Acquisition of Chubu Toshiba Engineering
Kioxia Holdings Corporation announced today that it completed the acquisition of Chubu Toshiba Engineering Corporation.
Global IoT Project of the Year 2022 Opens for Entries
Wialon has announced that the IoT project of the year 2022 is now open to enter.
SEMI ISS Europe Opens With Spotlight on Sustainability, Supply Chain Resilience and Talent
Key executives from leading semiconductor companies, market analysts, economists and policymakers gather today for insights into the latest electronics industry trends, challenges and opportunities in Brussels, Belgium at the annual Industry Strategy Symposium Europe (ISS Europe) 2022.
