Samsung Electronics Co., Ltd. and Red Hat, Inc. today announced a broad collaboration on software technologies for next-generation memory solutions.
Argonne Scientists Use Quantum Computers to Simulate Quantum Materials
Scientists achieve important milestone in making quantum computing more effective.
Diamondx Selected for Internet of Things Semiconductor Test
Cohu, Inc. today announced a U.S. semiconductor manufacturer has selected the Diamondxplatform for testing their product portfolio.
GS Microelectronics (GSME) Enters Market as Globally Focused Outsourced Semiconductor Manufacturing and Operations Solutions Provider
GS Microelectronics, Inc. today announced its official launch as a global provider of Outsourced Semiconductor Manufacturing and Operations (OSeMO) services.
Showa Denko’s Program to Develop 8-inch SiC Wafers for Next-generation Green Power Semiconductor Selected for NEDO’s Green Innovation Fund Projects
Showa Denko proposed its “Project to Develop SiC Wafers Technology for Next-generation Green Power Semiconductors” to New Energy and Industrial Technology Development Organization (NEDO) as a candidate for “Projects to Develop Wafers Technology for Next-generation Power Semiconductors” which was set as a research and development target of “Next-generation Digital Infrastructure Construction” in “Green Innovation Fund Projects”.
DVCon U.S. 2023 Announces Call for Extended Abstracts
The 2023 Design and Verification Conference and Exhibition United States (DVCon U.S.), sponsored by Accellera Systems Initiative, announces its call for extended abstract proposals.
China-Based IC Production to Represent 21.2% of China IC Market in 2026
Foreign companies (e.g., Samsung, SK Hynix, TSMC, etc.) are expected continue to comprise more than 50% of IC production in China through 2026.
Synopsys and Analog Devices Collaborate to Accelerate Power System Design
Synopsys, Inc. and Analog Devices, Inc. today announced their collaboration to provide model libraries for DC/DC ICs and µModule (micromodule) regulators with Synopsys’ industry-leading simulation tool, Saber, part of Synopsys’ virtual prototyping solution.
Tiny Infrared Spectral Filters for Remote Thermal Sensing and Imaging
Readily field-deployable on-chip microspectrometer technology has applications requiring mechanical robustness, such as robotic vehicles and airborne unmanned aerial vehicles.
CMP Consumables – Supply is Tight and Costs Expected to Rise
TECHCET announced the Chemical Mechanical Planarization (CMP) consumables market for semiconductors grew almost 13% in 2021 to reach US$3.0 billion.
