A toothpaste-based transistor is the latest innovation from the research team at the Istituto Italiano di Tecnologia (IIT-Italian Institute of Technology) in Milan, which pushes the boundaries of edible electronics.
Qamcom Collaborates with Pragmatic and Harvard on Applications in Wearables, Healthcare, and Smart Packaging
Qamcom, a knowledge-based research and technology consulting company within hardware, software and system development, announces joint research project and publication of article ‘Bendable non-silicon RISC-V microprocessor’.
Critical Manufacturing Welcomes Jeff Winter as Head of Business Strategy
Critical Manufacturing announced the appointment of Jeff Winter as VP of Business Strategy.
Global Semiconductor Industry Plans to Invest $400 Billion in 300mm Fab Equipment Over Next Three Years
Global spending on 300mm fab equipment is expected to reach a record US$400 billion from 2025 to 2027, SEMI highlighted today in its quarterly 300mm Fab Outlook Report to 2027 report.
Silicon Creations Awarded TSMC’s 2024 Open Innovation Platform Partner of the Year for Mixed Signal IP
Silicon Creations announced that it has been named a 2024 TSMC Open Innovation Platform (OIP) Partner of the Year for Mixed Signal IP.
TSMC and Cadence Collaborate to Deliver AI-Driven Advanced-Node Design Flows, Silicon-Proven IP and 3D-IC Solutions
Cadence Design Systems, Inc. today announced that it is collaborating with TSMC to enhance productivity and optimize product performance for AI-driven advanced-node designs and 3D-ICs.
Greene Tweed Welcomes Adam Phan as General Manager, Sealing Systems
Greene Tweed, a global manufacturer of high-performance sealing solutions and engineered components, announced the appointment of Adam Phan as the company’s new General Manager of Sealing Systems.
Murata Awarded 2024 Supplier of the Year – Best Quality at Qualcomm Supplier Summit
Murata announced that it was awarded with Qualcomm’s 2024 Supplier of the Year – Best Quality at the Qualcomm Supplier Summit in San Diego on August 27.
Synopsys and TSMC Pave the Path for Trillion-Transistor AI and Multi-Die Chip Design
Synopsys, Inc. today announced its continued, close collaboration with TSMC to deliver advanced EDA and IP solutions on TSMC’s most advanced process and 3DFabric technologies to accelerate innovation for AI and multi-die designs.
SIA Applauds Finalization of First CHIPS Award for Polar Semiconductor
The Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer applauding the first finalized agreement to allocate incentives under the CHIPS and Science Act.
