Heraeus Electronics today announced the launch of its new PowerCu Soft Laser Ribbons (LRB) for Laser Bonding during PCIM Europe in Nuremburg.
STMicroelectronics Appoints SP Group to Establish Singapore’s Largest Industrial District Cooling System for its Local Manufacturing Site
STMicroelectronics and SP Group announced today the signing of an agreement to install a district cooling system at ST AMK TechnoPark.
Renesas to Invest and Restart Operation of Kofu Factory as 300mm Wafer Fab Dedicated for Power Semiconductors
Boosting power semiconductor production capacity in response to growing demand for EVs.
New Silicon Nanowires Can Really Take the Heat
Scientists have demonstrated a new material that conducts heat 150% more efficientlythan conventional materials used in advanced chip technologies.
imec Spin-Off SOLiTHOR Closes a €10M Seed Investment Round to Develop a New Disruptive Solid-State Battery Cell Technology
The proceeds will be used to develop the technology required to enable further electrification of our transport industry with solutions that address current issues in autonomy, performance, longevity and safety.
DuPont Opens New Kapton and Pyralux Production Line in Circleville, Ohio
DuPont Interconnect Solutions, a business within the Electronics & Industrial segment, recently held a ribbon-cutting ceremony with elected officials and business leaders to formally mark the completion of its $250 million capital project to expand production of Kapton polyimide film and Pyralux flexible circuit materials at the Circleville manufacturing site.
Quadric and MegaChips Form Partnership to Bring IP Products to ASIC and SoC Market
Quadric and MegaChips today announced a strategic partnership to deliver ASIC and SoC solutions built on Quadric’s groundbreaking edge AI processor architecture.
imec Unites Partners from the Semiconductor Value Chain to Jointly Target Net-Zero Emissions for Chip Manufacturing
imec announces that its Sustainable Semiconductor Technologies and Systems (SSTS) research program succeeded in bringing together stakeholders of the semiconductor value chain.
Electronic Skin: Physicist at TU Graz Develops Multisensory Hybrid Material
The “smart skin” developed by Anna Maria Coclite is very similar to human skin. It senses pressure, humidity and temperature simultaneously and produces electronic signals. More sensitive robots or more intelligent prostheses are thus conceivable.
Samsung Has 18 Talks at the VLSI Symposia in June, Including 3nm GAAFET LDO
The VLSI Symposia are coming up on June 12 – 17, at the Hilton Hawaiian Village in Honolulu, and recently their media associates released the tipsheet describing some of the upcoming papers.
