Picosun has brought a stable MLD process to the realm of batch processing with PICOSUN P-300B ALD tool with batch sizes up to 27 pieces of 200mm wafers.
SkyWater Enters License Agreement with Xperi for Hybrid Bonding Technology
Hybrid bonding capability strongly complements SkyWater’s developing portfolio of heterogeneous integration solutions including silicon interposer and fan-out packaging.
Moov Announces Real-Time Logistics Tracking via Moov Portal, a Full-service Digital Marketplace for Buying Used Semiconductor Equipment
Moov, a data-fueled marketplace for used semiconductor manufacturing equipment, today announced its marketplace now serves as a one-stop shop for the second-hand buying experience.
Tignis Announces $7.2 Million in Series A Funding
Tignis today announced the completion of $7.2 million in Series A Funding led by early-stage venture capital fund DN Capital with participation by Silicon Valley venture capital firm Clear Ventures.
Dover To Acquire Manufacturer Of Flow-Measurement Devices For Biopharma And Semiconductor Production Applications
Malema will become part of the PSG business unit within Dover’s Pumps & Process Solutions segment.
Mitsubishi Electric Expands Silicon Carbide Power Device Lineup With Industry Standard Package Dual Device
Mitsubishi Electric US, Inc. recently launched a new Silicon Carbide (SiC) power module FMF400DY-24B
AI Traffic Light System Could Make Traffic Jams a Distant Memory
Long queues at traffic lights could be a thing of the past, thanks to a new artificial intelligence system developed by Aston University researchers.
Classiq Announces the Classiq Coding Competition
Classiq today announced the Classiq Coding Competition, rewarding those that create highly-efficient quantum circuits to solve important real-world problems.
Tachyum Delivers the Highest AI and HPC Performance with the Launch of the World’s First Universal Processor
Tachyum today launched the world’s first universal processor, Prodigy, which unifies the functionality of a CPU, GPU and TPU in a single processor, creating a homogeneous architecture, while delivering massive performance improvements at a cost many times less than competing products.
UPVfab Adds Micro-Transfer Printing Technology for Hybrid Photonic Integration
Massively parallel pick-and-place of large arrays of III-V semiconductors bring new heterogeneous integration capabilities for silicon photonics.
