2.5-dimensional materials promise new applications for artificial intelligence, electronics, automobiles and the energy sector.
ACM Research Receives Purchase Contract for Ultra ECP ap High-Speed Plating Systems
ACM Research, Inc. today announced that a volume purchase contract has been received from a leading Chinese OSAT for 10 Ultra ECP ap high-speed plating tools, which are scheduled to be delivered later in 2022 and 2023.
Industry R&D Spending To Rise 9% After Hitting Record in 2021
New update shows Intel continues to lead research and development ranking, the top 10 raised spending 18% last year, and 21 companies invested $1 billion or more on R&D in 2021.
MaxLinear to Acquire Silicon Motion
Business combination roughly doubles MaxLinear’s total addressable market opportunity to $15 billion and creates a top-ten fabless semiconductor supplier.
Researchers Create Flat Magic Window with Liquid Crystals
For the first time, researchers have used liquid crystals to create a flat magic window — a transparent device that produces a hidden image when light shines on it.
Using AI to Analyze Large Amounts of Biological Data
University of Missouri researchers develop method which could be used by scientists when developing new drug therapies for medical treatment of cancers, other diseases.
New Shape Memory Alloy Discovered Through Artificial Intelligence Framework
Funded by the National Science Foundation’s Designing Materials to Revolutionize Our Engineering Future (DMREF) Program, researchers from the Department of Materials Science and Engineering at Texas A&M University used an Artificial Intelligence Materials Selection framework (AIMS) to discover a new shape memory alloy.
ROHM’s New 600V Super Junction MOSFETs: Delivering Low ON Resistance
ROHM Semiconductor today announced that they have added seven new devices, the R60xxVNx series, to the PrestoMOS lineup of 600V Super Junction MOSFETs which stand out for their class-leading low ON resistance and the industry’s fastest reverse recovery time (trr).
Purdue, Ivy Tech Partner on Next-Generation Microelectronics Workforce
Purdue University and Ivy Tech Community College are partnering to help meet the future workforce needs in microelectronics, a field that is expected to add more than 100,000 workers over the next decade.
Soitec On Track to Enlarge Silicon Carbide Product Portfolio with First 200mm SmartSiC Engineered Substrate
Soitec (Euronext Paris) has released its first 200mm silicon carbide SmartSiC wafer.
