Kandou today opened its first office in Taipei, Taiwan.
ROHM and Delta Electronics Form a Strategic Partnership to Develop GaN Power Devices
Global semiconductor supplier ROHM Semiconductor and power supply manufacturer Delta Electronics today announced that they have entered into a strategic partnership to develop and mass-produce next-generation GaN (gallium nitride) power devices.
Pierre Marchal Joins SiPearl as Chief Financial Officer
SiPearl, the company designing the high-performance, low-power microprocessor for European exascale supercomputers, announces the appointment of Pierre Marchal as Chief Financial Officer.
Porotech Showcases The Brightest Native Full Color InGaN-Based MicroLED Display Projections at Touch Taiwan
The breakthrough of making native InGaN-based R/G/B on a single material and tool chain accelerates microLED’s commercialization.
Top 10 Companies Hold 57% of Global Semi Marketshare
In 2021, five of the top 10 semiconductor companies were fabless suppliers. In 2008, there was one fabless company in the ranking; in 2000, there were none.
IBM Research and Nova Jointly Awarded the “Best Metrology Paper” at SPIE Advanced Lithography Conference
Nova today announced that its co-authored paper with IBM Research on “In-Line Raman Spectroscopy for Stacked Nanosheet Device Manufacturing” has been selected as the winner of the Diana Nyyssonen award for “best paper at SPIE’s 2021 Advanced Lithography Symposia.”
Space-Saving Schottky Rectifiers from Diodes Incorporated Set New Benchmarks in Current Density
Diodes Incorporated has announced the introduction of a series of high-current Schottky rectifiers in ultra-compact chip scale packages (CSPs).
Ayar Labs Raises $130 Million in Series C Funding, Accelerating Commercialization of Industry’s First In-Package Optical I/O Products
Boardman Bay Capital Management leads round joined by strategic investments from industry bellwethers Hewlett Packard Enterprise and NVIDIA, fast-tracking Ayar Labs’ transformational technology for AI, HPC, cloud, and telecom applications.
ClassOne Equipment Introduces New Takano Particle Inspection Systems to Replace Outdated Legacy Tools
ClassOne Equipment has just introduced two new high-performance Takano particle inspection systems for ≤200mm and ≤300mm unpatterned wafers.
DENSO and USJC Collaborate on Automotive Power Semiconductors
DENSO Corporation and United Semiconductor Japan Co., Ltd. today announced that the companies have agreed to collaborate on the production of power semiconductors at USJC’s 300mm fab in order to serve the growing demand in the automotive market.
