The Taiwan Semiconductor Manufacturing Company (TSMC) has begun work on a 10-billion-euro plant in Dresden as the European Union approves state assistance for the project.
Pfeiffer Vacuum Introduces New HiQuad Neo Mass Spectrometer
With its new HiQuad Neo mass spectrometer, Pfeiffer Vacuum combines powerful performance with flexibility and user-friendly operation.
MULTI-DOF Technology from HEIDENHAIN Gives Hybrid Bonding a Boost
While a reduction in production throughput had been an acceptable compromise for smaller structures in previous years, a significant increase in productivity is now back on the agenda of semiconductor manufacturers. HEIDENHAIN encoders with MULTI-DOF TECHNOLOGY unlock these new dimensions of higher accuracy and performance.
Diraq Drives Two-Qubit Gate Accuracy in CMOS to Above 99%
Diraq announced it has successfully demonstrated consistent and repeatable operation with above 99% fidelity of two-qubit gates in the SiMOS (silicon metal-oxide-semiconductor) quantum dot platform.
Inspired by the Human Body, Engineer Designs Chips that Could Make Wearable AI More Energy Efficient
Is it possible to use artificial intelligence tools like ChatGPT without internet access?
xMEMS Introduces 1mm-Thin Active Micro-Cooling “Fan on a Chip”
xMEMS Labs today announced its latest industry-changing innovation: the xMEMS XMC-2400 µCooling chip, the first-ever all-silicon, active micro-cooling fan for ultramobile devices and next-generation artificial intelligence (AI) solutions.
NUS and A*STAR Researchers Develop Wearable, Stretchable Sensor
The novel sensor accurately measures markers such as cholesterol and lactate — crucial for the early detection of diseases.
Kopin Awarded First Order for High Resolution Microdisplay Assembly for Use in Sophisticated Electronics Manufacturing Systems
Kopin Corporation today announced that it received the first production purchase order for its high resolution, 4 Megapixel 2K-R11 FLCoS Spatial Light Modulator (“SLM”) system for use within 3D AOI (“3-Dimensional Automated Optical Inspection”) machines.
OKI Sets Up New PCB Manufacturing Line for Semiconductor Manufacturing and Testing Equipment at Joetsu Plant
The OKI Group PCB business company OKI Circuit Technology has set up a new ultra-high-multilayer PCB line at the Joetsu Plant in Joetsu City, Niigata Prefecture, with full-scale operations commencing in July.
Global Semiconductor Manufacturing Industry Strengthens in Q2 2024, SEMI Reports
The global semiconductor manufacturing industry in the second quarter of 2024 continued to show signs of improvement with significant growth of IC sales, stabilizing capital expenditure, and an increase in installed wafer fab capacity, SEMI announced today
