Sales hit highest-ever monthly total in November; worldwide chip sales increase 1.6% month-to-month.
Lumotive Introduces Transformative Advanced 3D Sensing with Sony Semiconductor at CES 2025
Lumotive today announced the integration of its MD41 Development Kit with Sony Semiconductor Solutions’ IMX459 and IMX560 SPAD depth sensors.
Imec and Partners Show Outdoor Stability of Highly Anticipated Perovskite Solar Modules
Imec, partner in EnergyVille, in collaboration with the University of Cyprus, has demonstrated long-term outdoor stability of perovskite solar modules.
Micron Breaks Ground on New HBM Advanced Packaging Facility in Singapore
Approximate $7 billion investment over the next several years to meet AI data center demand.
Aledia Unveils Breakthrough MicroLED Technology at CES 2025
At CES 2025, Aledia today unveiled the availability of its game-changing microLED technology set to redefine the future of hardware for augmented reality and to power the next generation of displays for vision applications.
CEA-Leti Will Unveil Major R&D Gains At Photonics West
CEA-Leti will present six papers at Photonics West, including an invited one, detailing its recent breakthroughs and major results for the future of photonics-based applications Jan. 25-30 in San Francisco.
FormFactor Expands Partnership with Advantest
Partnership builds on a multi-year collaboration to accelerate industry innovation in enabling advanced packaging and high-performance-compute.
Department of Commerce Announces CHIPS Incentives Award with Hemlock Semiconductor
Today, the Biden-Harris Administration announced that the U.S. Department of Commerce awarded Hemlock Semiconductor (HSC) up to $325 million in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication facilities.
AI Slashes Cost and Time for Chip Design, But That’s Not All
Researchers at Princeton Engineering and the Indian Institute of Technology have harnessed artificial intelligence to take a key step toward slashing the time and cost of designing new wireless chips and discovering new functionalities to meet expanding demands for better wireless speed and performance.
Marvell Announces Breakthrough Co-Packaged Optics Architecture for Custom AI Accelerators
Marvell Technology, Inc. today announced the advancement of its custom XPU architecture with co-packaged optics (CPO) technology.
