Key executives from leading semiconductor EDA and IP companies will gather to discuss the latest industry trends, challenges and opportunities Thursday, April 28, in Santa Clara, California.
New Stochastics Solutions from Fractilia Enables Semiconductor EUV Fabs to Control Yield Problem
Fractilia today announced that it has released the latest version of its Fractilia Automated Measurement Environment (FAME) product to enable semiconductor fabs to control the multi-billion-dollar EUV yield problem of stochastics.
SIA Endorses FABS Act Introduced in House
The Semiconductor Industry Association (SIA) today applauded introduction in the House of Representatives of the Facilitating American-Built Semiconductors (FABS) Act, bipartisan legislation that would establish an investment tax credit to incentivize semiconductor manufacturing, design, and research in the United States.
Researchers Develop the World’s First Power-Free Frequency Tuner Using Nanomaterials
In a paper published today in Nature Communications, researchers at the University of Oxford and the University of Pennsylvania have found a power-free and ultra-fast way of frequency tuning using functional nanowires.
Multinational Semiconductor Company Orders Multiple Veeco Wet Processing Systems for Advanced Packaging Applications
Veeco Instruments Inc. today announced that a semiconductor manufacturer has ordered multiple Veeco WaferStorm Wet Processing Systems for advanced packaging applications.
Semiconductor IP Market Size Worth $9.67Bn, Globally, by 2028 at 10% CAGR
The semiconductor IP market size is expected to grow from $4.95 billion in 2021 to $9.67 billion by 2028; it is estimated to grow at a CAGR of 10% from 2021 to 2028.
Scientists Devise New Technique to Increase Chip Yield from Semiconductor Wafer
Scientists from the Korea Institute of Machinery & Materials (KIMM, President Sang Jin Park) under the Ministry of Science and ICT, and the Nanyang Technological University, Singapore (NTU Singapore, President Subra Suresh) have developed a technique to create a highly uniform and scalable semiconductor wafer, paving the way to higher cup yield, more cost-efficient semiconductors and mitigating the global chip shortage.
Ln-Doped Lead-Free Double Perovskite Based Ultra-Broadband LED
Lanthanide ions were successfully incorporated into Bi:Cs2AgInCl6 lead-free double perovskite (DP), yielding ultrabroadband continuous emission. To reduce energy transfer and cross-relaxation processes among activators, “DP-in-glass composite” (DiG) structure was designed, whose PLQY is almost three times that of a multi-doped DP. Finally, a compact ultrabroadband (400~2000 nm) light source was fabricated by coupling the DiG with commercial UV LED chip, which has promising applications in nondestructive spectroscopic analyses and multifunctional illumination.
Scientists Have Improved Polymer Films for Organic Electronics
Researchers improved polymer films, the basis for organic electric. The new material is promising for increasing the capacity in lithium polymer batteries, solar cells, and modernization of organic field-effect transistors.
Moov Announces New Tempe, Arizona HQ, Plans to Triple Headcount in 2022
Moov, a data-fueled marketplace for used semiconductor manufacturing equipment, today announced the location of its new headquarters in the 100 Mill building in Tempe, Arizona.
