Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, and Fixstars Corporation, a developer of multi-core CPU/GPU/FPGA acceleration technology, announced their intention to collaborate in the automotive deep learning field.
Leaders in Semiconductors, Packaging, IP Suppliers, Foundries, and Cloud Service Providers Join Forces to Standardize Chiplet Ecosystem
Advanced Semiconductor Engineering, Inc. (ASE), AMD, Arm, Google Cloud, Intel Corporation, Meta, Microsoft Corporation, Qualcomm Incorporated, Samsung, and Taiwan Semiconductor Manufacturing Company today announced the formation of an industry consortium that will establish a die-to-die interconnect standard and foster an open chiplet ecosystem.
Silvaco Announces that Teledyne e2v Expands Adoption of its Victory TCAD Solution to Further Accelerate Development of CMOS Image Sensors
Silvaco Group, Inc., a provider of TCAD, EDA software, and Design IP, today announced that Teledyne e2v, a global leader in imaging solutions, has renewed its commitment to Silvaco’s Victory TCAD solution to accelerate its CMOS image sensor development.
STMicroelectronics Recognized as Top 100 Global Innovator 2022
STMicroelectronics has been named Top 100 Global Innovator 2022.
EV Group and Teramount Announce Collaboration to Implement Innovative Packaging Technologies for Photonic Integrated Circuits
The collaboration will leverage EVG’s nanoimprint lithography (NIL) technology, expertise and services with Teramount’s PhotonicPlug technology.
Scanning Electron Microscopy Takes the Spotlight in Annual Deep Learning Survey by the eBeam Initiative
The eBeam Initiative, a forum dedicated to the education and promotion of new semiconductor manufacturing approaches based on electron beam (eBeam) technologies, today published its second annual Deep Learning (DL) survey of its members’ products and applications using DL in the photomask to wafer manufacturing flow.
Energy-efficient AI Semiconductor Company EdgeCortix Closes Series A Funding
EdgeCortix the AI-focused fabless semiconductor company today announced that it has closed over $8 Million USD in series A funding
Samco Opens Research Center for Nano Thin Films & Materials to Accelerate ALD Development
Samco, a manufacturer of etching, deposition and surface treatment processing equipment for the semiconductor and related industries and academic facilities, has opened the new Research Center for Nano Thin Films & Materials for ALD and mist CVD process and system development in Kyoto, Japan.
Micron Delivers World’s Most Advanced 176-Layer NAND Data Center SSD
Micron Technology, Inc., today announced it is sampling the world’s first vertically-integrated 176-layer NAND solid-state drive (SSD) for the data center.
CEVA Announces Milestone of 100 Million CEVA-powered Cellular IoT Chips Shipped
CEVA, Inc., the licensor of wireless connectivity and smart sensing technologies and integrated IP solutions, today announced that more than 100 million CEVA-powered cellular IoT chips have been shipped by CEVA licensees since the beginning of 2020.
