Shannon Davis

News and Web Editor

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Shannon, writes, edits and produces Semiconductor Digest’s news articles, email newsletters, blogs, webcasts, and social media posts. She holds a bachelor’s degree in journalism from Huntington University in Huntington, IN. In addition to her years of freelance business reporting, Shannon has also worked in marketing and public relations in the renewable energy and healthcare industries.

New Semiconductor Material: AlYN Promises More Energy-Efficient and Powerful Electronics

Researchers at Fraunhofer IAF have succeeded in growing AlYN/GaN heterostructures in a MOCVD reactor on 4-inch SiC substrates.

Investment Opportunities in the Semiconductor Materials Supply Chain

It’s 2024: the semiconductor industry is experiencing growth driven by AI and leading-edge technology, with demand expected to sharply increase in 2025 as fab expansions ramp.

Veeco Announces Agreement with IBM to Explore Wet Processing Systems for Advanced Packaging Applications

Veeco Instruments Inc. (NASDAQ: VECO) today announced that IBM selected the WaferStorm Wet Processing System for Advanced Packaging applications and has entered into a joint development agreement to explore advanced packaging applications using multiple wet processing technologies from Veeco.

IMAPS 57th International Symposium on Microelectronics Planned for September 30 – October 3, 2024, in Boston

The 57th International Symposium on Microelectronics (IMAPS 2024) will be held September 30 – October 3, 2024, at the Encore Boston Harbor in Boston, Massachusetts. 

AMD Completes Acquisition of Silo AI

AMD today announced the completion of its acquisition of Silo AI, the largest private AI lab in Europe.

Tachyum Builds Last FPGA Prototypes Batch Ahead of Tape-Out

Tachyum today announced the final build of its Prodigy FPGA emulation system in advance of chip production and general availability next year.

Movellus Joins the Silicon Catalyst In-Kind Partner Ecosystem

Movellus today announced that it has joined the Silicon Catalyst ecosystem as the newest member of their In-Kind Partner (IKP) network. 

Microchip and Acacia Collaborate to Enable Optimized Terabit-Scale Data Center Interconnect Systems

The companies enable an interoperable coherent optics ecosystem that can help streamline the development of data center interconnect and metro transport systems.

HKUST Engineering Researchers Pave the Way for Advanced Wearable Display Technologies

A research team led by the School of Engineering of the Hong Kong University of Science and Technology (HKUST) has developed full-color fiber light-emitting diodes utilizing perovskite quantum wires (PeQWs), paving the way for innovative wearable lighting and display devices.

Cerabyte Joins CERN openlab

Cerabyte today announced that it has become an official CERN openlab member.