STMicroelectronics, a manufacturer of Micro-Electro-Mechanical Systems (MEMS), today announced the launch of the Intelligent Sensor Processing Unit (ISPU) that combines a Digital Signal Processor (DSP) suited to run AI algorithms and MEMS sensor on the same silicon.
Classiq Announces $33M in New Funding, Accelerating Its Journey to Become the Leading Quantum Software Development Platform
In yet another sign that the world is moving from quantum exploration to quantum production – and that quantum software development is a key ingredient in gaining quantum advantage – Classiq, which provides a breakthrough platform for Quantum Algorithm Design, today announced that it has raised $33 million in a Series B round.
Orca Systems Announces World’s First Fully Integrated SoC Solution for Direct-to-Satellite IoT Connectivity
Orca Systems, a fabless semiconductor company, today announced its first wireless system-on-chip (SoC) solution for the satellite Internet of Things (IoT), the ORC3990.
Veeco’s Laser Annealing Platform Wins Multi-System Orders and Production Tool of Record Status at a Leading Semiconductor Manufacturer
Veeco Instruments Inc. announced today that multiple leading semiconductor manufacturers have placed repeat, multi-system orders for Veeco’s LSA101 and LSA201 Laser Annealing Systems.
AAEON Partners with AI Chipmaker Hailo to Enable Next-Gen AI Applications at the Edge
UP Bridge the Gap, a brand of AAEON – a manufacturer of AI Edge hardware solutions – announced a partnership with Hailo, an Artificial Intelligence (AI) chipmaker, to meet skyrocketing demands for next-generation AI applications at the edge.
SK hynix Develops PIM, Next-Generation AI Accelerator
SK hynix announced on February 16 that it has developed PIM, a next-generation memory chip with computing capabilities.
Keysight, Samsung Sign Memorandum of Understanding to Advance Research and Development of 6G Technology
Keysight Technologies, Inc. announced that the company has signed a memorandum of understanding (MoU) with Samsung Research to advance research and development of 6G technology, the next generation of wireless communication.
Lawrence Berkeley National Laboratory Unveils ASIC Chip Failure Bypass System
Lawrence Berkeley National Laboratory (Berkeley Lab) scientists have developed a technique to automatically bypass failed Application Specific Integrated Circuits (ASICs) deployed in large arrays by rerouting dynamically around them.
Gigaphoton Sells KrF Excimer Laser to National Research Institute in Taiwan
Gigaphoton Inc., a manufacturer of light sources used in semiconductor lithography, has announced that its KrF excimer laser ‘G300K’ for processing applications has been chosen for use in a project led by the National Applied Research Laboratories in Taiwan and sold to National Cheng Kung University on December 27.
With Tower Acquisition, Intel Will Take Over Industry’s Ninth Largest Pure-Play Foundry
Based on data compiled for Knometa’s new Global Wafer Capacity 2022 report, Tower was industry’s ninth largest foundry at the end of 2021 in terms of installed capacity.
