Shannon Davis

News and Web Editor

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Shannon, writes, edits and produces Semiconductor Digest’s news articles, email newsletters, blogs, webcasts, and social media posts. She holds a bachelor’s degree in journalism from Huntington University in Huntington, IN. In addition to her years of freelance business reporting, Shannon has also worked in marketing and public relations in the renewable energy and healthcare industries.

VSORA Introduces Tyr Chip Family Enabling L2-L5 Autonomous Driving

VSORA, provider of high-performance silicon intellectual property (IP) solutions for artificial intelligence (AI), digital communications and advanced driver-assistance systems (ADAS) applications, today unveiled a family of PetaFLOPS computational companion chips to accelerate Level 3 (L3) through Level 5 (L5) autonomous vehicle designs.

TANAKA Denshi Kogyo to Establish New Plant in Hangzhou, China

TANAKA Holdings Co., Ltd. has announced that its subsidiary, TANAKA Denshi Kogyo K.K., which is engaged in the production of various types of bonding wires, will establish a new plant in Hangzhou City, China, for the production of aluminum bonding wires for power semiconductors.

SEMI Issues Recommendations for European Commission to Bolster Europe’s Chip Ecosystem Resilience and Competitiveness

SEMI, the global industry association that unites the entire electronics manufacturing and design supply chain, has issued recommendations to the European Commission for growing Europe semiconductor ecosystem resilience and competitiveness.

Micron Ships the Industry’s First 176-Layer QLC NAND in Volume and Unveils the 2400 PCIe Gen4 Client SSD

Micron Technology, Inc. today announced it has begun volume shipments of the world’s first 176-layer QLC NAND SSD. Built with the most advanced NAND architecture, Micron’s 176-layer QLC NAND delivers the industry’s leading storage density and optimized performance for a broad range of data-rich applications.

Micron Announces CFO Transition

Micron Technology, Inc. today announced that David Zinsner, executive vice president and chief financial officer, has resigned from the company.

Imec Tenure-Track Holder Christian Haffner Awarded With ERC Starting Grant

Today, imec, the research and innovation hub in nanoelectronics and digital technologies, announces that the European Research Council (ERC) has awarded a prestigious Starting Grant to Christian Haffner.

SPIE, the International Society for Optics and Photonics, Announces Its 2022 Society Awards

The Awards Committee of SPIE, the international society for optics and photonics, today announced the recipients of its prestigious annual awards.

Global Fab Equipment Spending Projected to Log Record High in 2022 to Mark Third Consecutive Year of Growth, SEMI Reports

Global fab equipment spending for front end facilities is expected to rise 10% year-over-year (YOY) in 2022 to a new all-time high of over US$98 billion, marking a third consecutive year of growth, SEMI highlighted today in its quarterly World Fab Forecast report.

Measuring Trust in AI

Prompted by the increasing prominence of artificial intelligence (AI) in society, University of Tokyo researchers investigated public attitudes toward the ethics of AI.

proteanTecs and Alchip Bring Production Visibility to Advanced ASICs

proteanTecs, a developer of deep data solutions for electronics health and performance monitoring, announced today a commercial agreement with Alchip Technologies Ltd., a high-performance computing ASIC company, to provide ASIC production visibility to fabless semiconductor companies in Greater China.