PanelSemi Corporation, a Taiwan-based panel semiconductor provider, is unveiling the world’s first flexible Active-Matrix (AM) Mini LED Display, called Primary, at the upcoming Consumer Electronic Show (CES) 2022 in Las Vegas, on January 5-8th.
xMEMS Announces Montara Pro, the World’s First MEMS Microspeaker with Integrated DynamicVent for Intelligent TWS Earbuds and Hearing Aids
xMEMS Labs today introduced Montara Pro, the world’s first monolithic MEMS µspeaker with integrated DynamicVent enabling smart TWS earbuds and hearing aids that create best-of-both-worlds user experiences combining the benefits of closed-fit (occluded) and open-fit earbuds.
UV LED: After the Impact of the COVID-19 Pandemic, What Is the Status of This Industry?
The COVID-19 pandemic has created some perfect use-cases for UV lighting technologies to spread throughout a rapidly changing disinfection market.
Georgia Tech Wins Commerce Department Grant to Develop AI Manufacturing Economic Corridor
The Georgia Institute of Technology was awarded a grant from the U.S. Department of Commerce’s Economic Development Administration (EDA) as part of its $1 billion Build Back Better Regional Challenge.
LG Display Unveils Next-Generation OLED TV Display ‘OLED EX’
LG Display unveiled today its newest OLED TV technology ‘OLED EX’.
Synopsys Chosen by Juniper Networks to Accelerate Development of Photonic ICs for Next-Gen Data Centers
Synopsys, Inc. today announced that Juniper Networks has adopted the Synopsys OptoCompiler platform, including the OptSim and PrimeSim HSPICE simulation solutions, to accelerate the development of photonic-enabled chips for the next generation of optical communications.
Heterogeneous Integration Chip-let System Package Alliance Established to Expand Market Opportunities
In order to enhance critical capabilities of Taiwan’s chip industry for this emerging market, the Department of Industrial Technology (DoIT), Ministry of Economic Affairs (MOEA), Taiwan, has supported ITRI to establish the Heterogeneous Integration Chip-let System Package Alliance (Hi-CHIP).
Researchers Uncover the Mechanism of Electric Field Detection in Microscale Graphene Sensors
The ability to sense the magnitude and polarity of the electric field is of great scientific interest. It has various real-life applications, such as early prediction of lightning and detection of supersonic aircraft.
SEMI Urges Upcoming French Presidency of the Council of the European Union to Make Semiconductor Industry a Top Priority
SEMI, the global industry association that unites the entire electronics manufacturing and design supply chain, urged closer cooperation among European Union member states on technology and prioritization of semiconductor technology ahead of the French Presidency of the Council of the European Union that begins January 1, 2022.
Nepes Laweh to Set New Industry Benchmark With 600mm Large Panel M-Series Fan-Out Volume Production
Nepes Laweh Corporation announced the successful production of the world’s first 600mm x 600mm large Panel Level Packaging (PLP) using Deca’s M-Series fan-out technologies.
