Shannon Davis

News and Web Editor

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Shannon, writes, edits and produces Semiconductor Digest’s news articles, email newsletters, blogs, webcasts, and social media posts. She holds a bachelor’s degree in journalism from Huntington University in Huntington, IN. In addition to her years of freelance business reporting, Shannon has also worked in marketing and public relations in the renewable energy and healthcare industries.

Polymatech and ECM Group Forge Strategic Joint Venture for Semiconductor Wafer Fabrication in Grenoble, France

The new venture will focus on producing sapphire ingots and wafers, key materials for advanced semiconductor devices.

Synopsys Powers World’s Fastest UCIe-Based Multi-Die Designs with New IP Operating at 40 Gbps

Synopsys, Inc. today announced the industry’s first complete UCIe IP solution operating at up to 40 Gbps per pin to address the increased compute performance requirements of the world’s fastest AI data centers.

Samsung Begins Industry’s First Mass Production of QLC 9th-Gen V-NAND for AI Era

Samsung Electronics today announced it has begun mass production of its one-terabit (Tb) quad-level cell (QLC) 9th-generation vertical NAND (V-NAND).

Omdia Forecasts Say Display Panel Fab Utilization Rate to Drop 14 Percentage Points to 68% in October 2024

Display panel makers forecast are set to make severe cuts to their fab utilization in October 2024, according to Omdia’s Display Production and Inventory Tracker.

PPG Launches PPG STEELGUARD 951 Fire Protection Coating in the Americas

PPG today announced the launch of PPG STEELGUARD 951 epoxy intumescent fire protection coating in the Americas.

Infineon Pioneers World’s First 300mm Power GaN Technology

Infineon Technologies AG today announced that the company has succeeded in developing the world’s first 300mm power gallium nitride (GaN) wafer technology.

Material Export Restrictions Poised to Strain Semiconductors

TECHCET has identified a potential strain on US semiconductor manufacturing capability as Chinese export restrictions on key materials have been announced.

MEMS & Imaging Sensors Summit to Highlight Innovations Driving the Next Generation of Connectivity

The SEMI MEMS & Imaging Sensors Summit, themed Sensor Revolution for a Connected Future, is set to bring together some of the world’s leading minds in sensor technology on November 14 at the International Conference Center Munich (ICM), Germany.

Samtec Orders ClassOne Technology Solstice S8 Single-Wafer System to Process Glass Core Technology Products

ClassOne Technology, a global provider of advanced electroplating and wet processing tools for microelectronics manufacturing, today announced it has received an order from new customer Samtec for a Solstice S8 single-wafer processing system.

JEDEC Publishes Essential Test Method to Address Switching Energy Loss in Wide Bandgap and Silicon Semiconductor Power Devices

JEDEC Solid State Technology Association today announced the publication of JEP200: Test Methods for Switching Energy Loss Associated with Output Capacitance Hysteresis in Semiconductor Power Devices.