PFAS elimination efforts expected to drive migration to photoresist alternatives.
Layering Stretchable and Rigid Materials and Incorporating Machine Learning Improves Accuracy of Wearables
A paper published in Device on August 7 outlines how rigid integrated circuits layered on a flexible substrate can be used to improve wearable performance.
‘Amphibious’ Sensors Make New, Waterproof Technologies Possible
Researchers have demonstrated a technique for creating sensors that can function both in air and underwater. The approach paves the way for “amphibious” sensors with applications ranging from wildlife monitoring to biomedical applications.
BrainChip Appoints New CMO, Enhances Scientific Advisory Board
BrainChip Holdings Ltd, the world’s first commercial producer of ultra-low power, fully digital, event-based, neuromorphic AI, today announced that it has hired Steven Brightfield as its new chief marketing officer and has re-envisioned its Scientific Advisory Board (SAB) by bringing on company founder Peter van der Made, Dr. Jason K. Eshraghian and Dr. André van Schaik.
Entegris Enters Into Long-Term Supply Agreement with onsemi
Entegris, Inc., a supplier of advanced materials and process solutions for the semiconductor and other high-technology industries, announced it has entered into a long-term supply agreement with onsemi, a leading manufacturer of advanced energy-efficient power semiconductors.
ACM Research Strengthens its Fan-Out Panel Level Packaging Portfolio with Launch of Ultra ECP ap-p Tool
ACM Research, Inc., a supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging applications, today announced its new Panel Electrochemical Plating (Ultra ECP ap-p) tool designed for fan-out panel-level packaging (FOPLP).
New Substrate Material for Flexible Electronics Could Help Combat E-Waste
Electronic waste is a rapidly growing problem, but this degradable material could allow the recycling of parts from many single-use and wearable devices.
New SEMI Foundation and Policy Equity Group Collaboration Earns Funding to Address Semiconductor Industry Child Care Gaps
Seeking to bolster the semiconductor industry workforce in the U.S. by addressing gaps in child care needs, the SEMI Foundation and Policy Equity Group today announced a collaboration to help companies comply with child care requirements under the U.S. CHIPS and Science Act.
U.S. Department of Commerce Announces Funds to SK hynix’s AI Memory Chip Facility
The preliminary memorandum of terms between the South Korean semiconductor manufacturer and the U.S. Department of Commerce will support high-bandwidth-memory AI chip production and advanced packaging R&D.
Omdia: All-in-One LED Competing to be the Next Generation of Meeting Room Display
Competition is heating up to be the display technology of choice for the corporate market as All-in-One (AIO) LEDs competes with LCD 21:9 and interactive displays for a slice of the $11.1bn corporate and conference room market in 2028.
