Toray Engineering Co., Ltd. has developed the TRENG-PLP Coater, a high-accuracy coating device for panel level packaging; PLP is an advanced semiconductor packaging technology.
The Rigaku Group’s XwinSys Changes its Name to Rigaku Semiconductor Instruments
To strengthen its manufacturing of equipment for advanced semiconductor packaging.
SEMICON Korea 2025 to Spotlight Edge Technologies Shaping the AI Era
SEMICON Korea 2025 will take place Feb. 19-21 in Seoul at the COEX offering a comprehensive look into AI-driven technological advancements and edge technologies poised to shape the future of the global semiconductor industry.
Student Research Supports Semiconductor Sustainability
TSMC-sponsored projects aim to improve use and manufacturing practices.
SEALSQ Partnering with Hedera in the Next Generation of Post-Quantum Semiconductors
SEALSQ Corp, a company that focuses on developing and selling Semiconductors, PKI and Post-Quantum technology hardware and software products, today announced a strategic partnership with Hedera.
Synopsys and SiMa.ai Announce Strategic Collaboration
Synopsys and SiMa.ai today announced a strategic collaboration to jointly deliver a new solution for automotive companies to accelerate the development of workload-specific silicon and software needed to power artificial intelligence-enabled features in next-generation automobiles.
YES RapidCure Systems Chosen by SkyWater Technology for Fan Out Wafer Level Packaging
YES has chosen the YES RapidCure polymer dielectric curing systems for their implementation of the M-Series fan-out wafer level packaging (FOWLP) technology in partnership with Deca Technologies ‘Deca’.
BTQ Technologies Appoints Radical Semiconductor Founders to Advance Commercialization of Post-Quantum Semiconductors
BTQ Technologies Corp., a global quantum technology company focused on securing mission-critical networks, announced the appointment of Sean Hackett and Zach Belateche—the co-founders of Radical Semiconductor—as advisors to the company.
Amkor Technology Names John Liu to Board of Directors
Amkor Technology, Inc., a provider of semiconductor packaging and test services, announced today that John Liu has been appointed as a new member of the company’s Board of Directors.
Frontgrade Gaisler Leads European Initiative for Ultra Deep Sub-Micron Semiconductor Technology for Space Applications
Under a newly signed contract with the European Space Agency (ESA), Frontgrade Gaisler is leading an ambitious initiative to secure European sovereignty in advanced semiconductor technologies for space applications.
