Soitec today announced the continuation of its research collaboration with the Microsystems Technology Laboratories (MTL) of the Massachusetts Institute of Technology (MIT), further solidifying its presence in the North American semiconductor sector.
ROHM’s PMICs for SoCs Adopted in Reference Designs for Telechips’ Next-Generation Cockpits
Intended for use inside the cockpits of European automakers, these designs are scheduled for mass production in 2025.
Posifa Technologies Introduces New MEMS Anemometer Sensor for HVAC Portable Anemometers and Fixed In-Duct Air Velocity Monitors
Posifa Technologies today introduced its new PAV5000 series MEMS anemometer sensor.
ASU-led Southwest Advanced Prototyping Hub Awarded $21.3M for Second Year of Funding for Microelectronics Projects
The Southwest Advanced Prototyping (SWAP) Hub, led by Arizona State University, has been awarded $21.3 million in Year 2 funding under the CHIPS and Science Act to continue its work advancing the rebirth of America’s microelectronics industry.
Ex Arm CTO Takes Chair Role at Optalysys
Optalysys, a company enabling the future of secure AI, backed by the Lingotto Investment Management LLP, imec.xpand, & Northern Gritstone, has appointed Dipesh Patel as Chair of its Board.
Silicon Industry Veteran Oreste Donzella Joins Sondrel Board as Non-Executive Director
Sondrel, a provider of ultra-complex custom chips, has announced that industry veteran, Oreste Donzella will join its board as a Non-Executive Director (NED) on January 1, 2025.
IBM Brings the Speed of Light to the Generative AI Era with Optics Breakthrough
New co-packaged optics innovation could replace electrical interconnects in data centers to offer significant improvements in speed and energy efficiency for AI and other computing applications.
Jeff Wilson of IBM Wins Si2 Pinnacle Award
Jeff Wilson, a software engineer in the IBM EDA development organization, has been honored with the quarterly Silicon Integration Initiative Pinnacle Award which recognizes volunteers for their professional contributions to Si2 programs.
Breakthrough Brings Body-Heat Powered Wearable Devices Closer to Reality
A QUT-led research team has developed an ultra-thin, flexible film that could power next-generation wearable devices using body heat, eliminating the need for batteries.
ROHM and TSMC Launch Strategic Gallium Nitride Technology Collaboration for the Automotive Industry
ROHM Co., Ltd. today announced that they have entered into a strategic partnership with TSMC on the development and volume production of gallium nitride (GaN) power devices for electric vehicle applications.
