The 2025 Symposium on VLSI Technology & Circuits will deliver a unique convergence of technology and circuits for the microelectronics industry to maximize the synergy across both domains.
YES Receives Multiple Orders of VertaCure PLP Systems for Advanced Packaging
Yield Engineering Systems (YES) is a manufacturer of process equipment for AI and HPC semiconductor solutions.
SEMI Industry Strategy Symposium 2025 Opens to Highlight Solutions for Managing Rapid Semiconductor Industry Growth
Industry Strategy Symposium (ISS) 2025 sessions open today gathering semiconductor industry executives for analysis of growth projections and pivotal business trends for the year ahead.
Sivers Semiconductors Signs CHIPS Act Contracts with the Northeast Microelectronics Coalition Hub
The first half of $11.6M Microelectronics Commons funding for 5G/6G and Electronic Warfare chip technology to be received by January 2025.
CHIPS Incentives Award with HP to Support Domestic Manufacturing
Today, the Biden-Harris Administration announced that the U.S. Department of Commerce awarded HPI Federal LLC up to $53 million in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities.
Heraeus Announces Merger
Heraeus is combining the high-performance materials expertise of Heraeus Conamic and Heraeus Comvance into a new operating company: Heraeus Covantics.
Archer Improves Quantum Carbon Film Material
Archer has improved the electron spin lifetime and sample-to-sample repeatability and uniformity for its manufacturable quantum carbon film.
Imec Announces Breakthrough in Electrically Pumped Nano-Ridge Lasers on Silicon
Imec has announced a significant milestone in silicon photonics with the successful demonstration of electrically-driven GaAs-based multi-quantum-well nano-ridge laser diodes fully, monolithically fabricated on 300mm silicon wafers in its CMOS pilot prototyping line.
Sivers Semiconductors Wins a Major Chip Development Program with Leading Tier-1 Telecom Infrastructure Vendor
The $5.4M program will support the development of a next-generation highly-integrated beamforming transceiver for a variety of mmWave telecom applications
Graphene Breakthrough: SEOULTECH’s Laser Technology Unveils Damage-Free Ultrathin Flexible Displays
A new graphene-assisted laser lift-off method keeps ultrathin displays flawless and ready for wearable technology.
