Newly discovered role of phase separation can help develop memory devices for energy-efficient AI computing.
xMEMS Micro Speaker Technology Delivers High-Quality Audio to New SOUNDPEATS TWS Earbuds
xMEMS Labs today announced collaboration with SOUNDPEATS to equip its all-new Capsule3 Pro+ TWS earbuds with its Cowell micro speaker.
NXP Combines Ultra-Wideband Secure Ranging and Short-Range Radar to Enable Autonomous Industrial and IoT Applications
NXP Semiconductors N.V. today announced the Trimension SR250, the industry’s first single-chip solution that integrates on-chip processing capabilities with both short-range UWB radar and secure ranging.
Intel Names New Representative to Si2 Board
Intel has a new representative on the Silicon Integration Initiative board of directors.
Boston Semi Equipment Enters Magnetic MEMS Testing Market with Initial Order from Leading Automotive IC Manufacturer
Boston Semi Equipment (BSE) today announced it has received an order from a global manufacturer of sensor integrated circuits (ICs) in the automotive market for its new Zeus handler configuration for magnetic micro-electromechanical systems (MEMS) testing.
Electrically Modulated Light Antenna Points the Way to Faster Computer Chips
Today’s computers reach their physical limits when it comes to speed. Semiconductor components usually operate at a maximum usable frequency of a few gigahertz – which corresponds to several billion computing operations per second.
Paul V. Walsh, Jr. Joins Kopin Corporation Board of Directors
Kopin Corporation today announced that Paul V. Walsh, Jr. has joined Kopin Corporation’s Board of Directors.
GlobalFoundries and Silicon Catalyst Partner to Accelerate Differentiated Technology Solutions for Semiconductor Startups
GlobalFoundries and Silicon Catalyst, the world’s only incubator+accelerator focused exclusively on semiconductor solutions, today announced that GF has joined the incubator’s semiconductor startup ecosystem as a Strategic Partner and an In-Kind Partner (IKP).
Brooks Instrument Celebrates New Manufacturing Site in Malaysia
Grand opening for the company’s fourth manufacturing facility highlights production and partnership opportunities with key customers in the Asia-Pacific region.
ACM Research Expands Fan-Out Panel-Level Packaging Portfolio with Launch of Ultra C bev-p Bevel Etching Tool
New double-sided bevel etching system enhances process efficiency and reliability in copper-related applications, supporting high-precision features on large panels.
