Hprobe, a provider of turnkey semiconductor Automatic Test Equipment (ATE) for magnetic devices, today announced a breakthrough magnetic test head revolutionizing MRAM Wafer Sort (WS).
Katana Graph and Intel Collaborate on Graph Analytics Python Library
Graph computing leader’s development of Python library and Metagraph plug-in expands opportunities for open core community and more impactful data insights.
Quantum Computers Getting Connected
Research team with participation of the University of Stuttgart succeeds in integrating color centers into nanophotonic silicon carbide structures.
SEMICON West 2021 to Gather Visionaries to Explore New Semiconductor Supply Chain Strategies and Opportunities
Future implications of ongoing global supply chain disruptions will take the spotlight as U.S. Deputy Secretary of Commerce Don Graves joins SEMI President and CEO Ajit Manocha for opening remarks at SEMICON West 2021 Hybrid, December 7-9 at the Moscone Center in San Francisco.
Micron and UMC Announce Global Settlement
United Microelectronics Corporation (TWSE: 2303; NYSE: UMC) and Micron Technology, Inc. (Nasdaq: MU) today announced a settlement agreement between the two companies worldwide.
Researchers Shrink Camera to the Size of a Salt Grain
Micro-sized cameras have great potential to spot problems in the human body and enable sensing for super-small robots, but past approaches captured fuzzy, distorted images with limited fields of view.
A*STAR’s Institute of Microelectronics and STMicroelectronics Team Up on Silicon Carbide R&D for the EV Market and Industrial Applications
The Institute of Microelectronics (IME) at the Agency for Science, Technology and Research (A*STAR) and STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, announced the start of a Research & Development (R&D) collaboration in the field of silicon carbide (SiC) for power-electronics applications in the automotive and industrial markets.
Advantest Announces New Versatile, High-Throughput Test Solution for NAND/Nonvolatile Flash Memory ICs
Semiconductor test equipment supplier Advantest Corporation (TSE: 6857) has introduced a new high-throughput memory tester for NAND flash devices that can perform functional testing of chips while delivering highly accurate timing, repeatability and failure detection.
CyberOptics to Deliver Technical Presentation About the Importance of 3D Inspection for Advanced Packaging at SEMICON Taiwan
CyberOptics Corporation (NASDAQ: CYBE), a developer and manufacturer of high-precision 3D sensing technology solutions will share a technical presentation at the Heterogeneous Integration Global Summit organized by SEMICON Taiwan Dec 1-3rd.
Forza Integrated Production Services Achieve Practical Yields for Back Side Illumination Sensors
Forza Silicon recently used its Integrated Production Services (IPS) to enable the production of high-speed image sensors that employ back side illumination (BSI) technology.
