Pure Wafer, a portfolio company of Edgewater Capital Partners and a supplier of silicon wafer solutions to the $500B semiconductor industry, announced today that it has acquired Noel Technologies.
SONGWON Invests in Capacity Expansion for Semiconductor Chemicals Production
Today, Songwon Industrial Co., Ltd. announced that it is investing in expanding its chemical production capacity for semiconductors.
JCET Expands Production Capacity in Suqian
JCET Group, a global integrated-circuit manufacturing and technology service provider, announced the official opening of the second phase of its IC packaging and testing facility in Suqian.
Picosun Strengthens its Position in the Semiconductor Market
Picosun Group strengthens its position in the 300 mm semiconductor market with its new generation ALD tool PICOSUN Sprinter.
Chroma Releases the Newest Semiconductor Test Solution
Chroma ATE Inc., a supplier of precision Test and Measurement Instrumentation, Automated Test Systems, Intelligent Manufacturing Systems, Turnkey Test and Automation Solutions has recently released the newest semiconductor test solution for the IoT IC market.
ClassOne’s Solstice LT Plating System Selected by Jenoptik for Producing High-Power Diode Lasers
Semiconductor equipment manufacturer ClassOne Technology announced the sale of its Solstice LT electroplating system to Jenoptik for manufacturing semiconductor material for high-power diode lasers at its semiconductor production facility in Berlin-Adlershof, Germany.
University of Louisville Selects Oxford Instruments Plasma Technology’s Deep Silicon Etch Solution for Leading Edge Research
Oxford Instruments Plasma Technology, a provider of plasma etching and deposition solutions to the compound semiconductor industry, announced that it has received an order for a PlasmaPro 100 Estrelas plasma etching system from the Micro/Nano Technology Center (MNTC) in the J. B. Speed School of Engineering at the University of Louisville.
Power Module Packaging Market Will Grow to Around US$3.5B by 2026
In 2020, motor drives represented the most significant power module market with a value of US$1.6 billion.
UArizona Researchers Develop Ultra-Thin ‘Computer on the Bone’
A team of University of Arizona researchers has developed an ultra-thin wireless device that grows to the surface of bone and could someday help physicians monitor bone health and healing over long periods.
CEA-Leti Unveils Breakthrough for Mass-Market, High-Performance, Navigation-Grade Gyroscopes
CEA-Leti scientists, in collaboration with researchers at Politecnico di Milano have developed the world’s smallest-footprint MEMS gyroscope that is capable of providing navigation-grade performance.
