The new 80V Power MOSFET technology has lower switching losses in hard switching, topologies and have less voltage overshoot than the previous generation.
Acorn and UCLouvain Professor Collaborate on Groundbreaking Silicon-on-Insulator Research Project
Acorn Technologies today announced a research collaboration with Jean-Pierre Raskin, PhD, a full professor at the Université catholique de Louvain (UCLouvain), Belgium’s largest French-speaking university.
Atonarp Announces Advisory Council of Science and Technology Experts to Boost Development of Digital Molecular Profiling
Atonarp, developer of digital molecular profiling instrument platforms and software applications for healthcare and industrial markets, announced today the establishment of its first strategic Advisory Council, consisting of nine distinguished science and technology industry leaders.
Sustainability in Semiconductor Manufacturing – A Review of Emissions and Materials Released Off-Site
By Chris Jones, Edwards Vacuum In the last post to this blog, we introduced the theme of sustainable manufacturing, which will be our ongoing focus. We described the evolving framework for limiting carbon emissions and reviewed the vocabulary we will use going forward. This post will briefly overview the materials released off-site during semiconductor manufacturing – what they are, where they come from, and where they go.
Mitsubishi Chemical Corporation Announces Expansion of Semiconductor Precision Cleaning Operations
Mitsubishi Chemical Corporation will invest over 10 million Euro for an expansion of its precision cleaning facility in Dresden, Germany.
RSBG Advanced Manufacturing Technologies GmbH Acquires Majority of Shares from Osiris International GmbH
RSBG Advanced Manufacturing Technologies GmbH (RSBG AMT), an investment company founded in 2019 and a wholly owned subsidiary of RSBG SE headquartered in Essen, Germany, holds 75.1% of Osiris International GmbH, headquartered in Singen, Germany, with retroactive effect from Jan. 1, 2021.
ERS Now Offers its Technology for Fan-out Debonding and Warpage Adjustment in a Fully-Automatic Machine for Panels up to 650 x 650 mm
ERS electronic, a developer of thermal management solutions for semiconductor manufacturing, is adding the Automatic Panel Debond Machine 650 (APDM650) to its portfolio of equipment for Advanced Packaging
YES Announces Strategic Partnership with Osiris for Edge Film Removal Technology
YES (Yield Engineering Systems, Inc.), a manufacturer of process equipment for semiconductor advanced packaging, life sciences and “More-than-Moore” applications, today announced that it has signed an exclusive agreement with Osiris (Osiris International GmbH) to license its smartEBR technology for edge bead removal on panels.
Fraunhofer ENAS Successfully Manufactures Ultra-Thin and Highly Flexible Parylene-Based Printed Circuit Boards with Several Metallization Layers
Scientists at the Fraunhofer Institute for Electronic Nano Systems ENAS in Chemnitz successfully developed and manufactured flexible printed circuit boards with an overall thickness of less than 20 micrometers and several metallization layers based on the polymer Parylene. The institute presents the new generation of flexible PCB this fall at the COMPAMED and the SEMICON Europa 2021.
Partnership Between SUSS MicroTec and SET to Develop a Combined Equipment Solution for 3D Chip Integration
SUSS MicroTec and SET announce a partnership in sequential die-to-wafer (D2W) hybrid bonding, a die-based interconnect technology, to provide a fully automated, customizable, highest-yield equipment to customers.
