Shannon Davis

News and Web Editor

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Shannon, writes, edits and produces Semiconductor Digest’s news articles, email newsletters, blogs, webcasts, and social media posts. She holds a bachelor’s degree in journalism from Huntington University in Huntington, IN. In addition to her years of freelance business reporting, Shannon has also worked in marketing and public relations in the renewable energy and healthcare industries.

SkyWater President and CEO, Thomas Sonderman, to Serve as Panelist at Purdue Workshop for Microelectronics and Advanced Packaging Workforce Development

SkyWater Technology (NASDAQ: SKYT) announced that its President and CEO, Thomas Sonderman, is serving as a panelist today at Purdue University’s Microelectronics and Advanced Packaging Workforce Development Workshop in West Lafayette, Indiana.

Researchers Observe Marcus Inverted Region of Charge Transfer from Low-Dimensional Semiconductor Materials

A research group led by Prof. WU Kaifeng from the Dalian Institute of Chemical Physics (DICP) of the Chinese Academy of Science (CAS) observed the Marcus inverted region of charge transfer from low-dimensional semiconductor materials.

SEMICON West 2021 Hybrid to Highlight Solutions to Global Challenges, Smart Technologies, Talent

Optimal readiness and stronger alliances across the semiconductor supply chain to confront future global disruptions will come into sharp focus at SEMICON West 2021 Hybrid, December 7-9 at the Moscone Center in San Francisco.

Nye Lubricants Launches New PFOA-Compliant Grease for Semiconductor Manufacturing

Nye Lubricants announced NyeClean 5057, a REACH-compliant, low outgassing grease for use within components in cleanroom manufacturing and vacuum environments.

High Current Rated TOLL MOSFETs from Diodes Incorporated Target EV Applications

Diodes Incorporated has introduced a portfolio of automotive MOSFETs packaged in the space saving, thermally-efficient TOLL package.

Samsung Announces Availability of Its Leading-Edge 2.5D Integration ‘H-Cube’ Solution for High Performance Applications

Samsung Electronics today announced that it has developed Hybrid-Substrate Cube (H-Cube) technology, its latest 2.5D packaging solution specialized for semiconductors for HPC, AI, data center, and network products that require high-performance and large-area packaging technology.

JSR Closes Deal to Acquire EUV Pioneer Inpria Corporation

JSR announced that it completed the acquisition of Corvallis, OR-based Inpria Corporation on Oct. 29, making it a wholly owned subsidiary of JSR.

The 2022 IEEE Symposium on VLSI Technology & Circuits Announces Call for Workshop Submissions

The 2022 IEEE Symposium on VLSI Technology & Circuits has announced a Call for Workshop topics in support of the conference theme: “Technology & Circuits for the Critical Infrastructure of the Future.”

After Strong Gains, DRAM Prices Expected To Retreat in 4Q21

DRAM buyers cautious about placing significant orders; opting instead to keep inventory in check.

Top European Research Center Selects Veeco’s Ion Beam Etch System for 5G RF Filter Production

Veeco Instruments Inc. announced today that Silicon Austria Labs (SAL) has selected Veeco’s Lancer Ion Beam Etch (IBE) System for the production of 5G RF Filters.