amBX announced today that it has appointed Jonathan Couch as Product and Solutions Director, a brand-new role for the business.
Primo1D Raises 15M Euros for Industrial-Scale Deployment
Primo1D today announced a new funding round of 15 million euros from major French capital funds.
aveni, SA Secures Patent For Groundbreaking, One-Step 3D NAND Wet Deposition Process That Replaces ALD And CVD Technologies
aveni SA today announced that it has secured a patent that can extend the industry standard of layers from 100 to 200+ layers on a single wafer for 3D NAND memory devices.
Samsung Develops Industry’s First LPDDR5X DRAM
Samsung Electronics Co., Ltd. today announced that it has developed the industry’s first 14-nanometer (nm) based 16-gigabit (Gb) Low Power Double Data Rate 5X (LPDDR5X) DRAM, designed to drive further growth throughout the high-speed data service applications including 5G, artificial intelligence (AI) and the metaverse.
Posifa Technologies Introduces New MEMS Thermal Conductivity Hydrogen Sensors for Safety Monitoring
Posifa Technologies today introduced its new PGS1000 series of MEMS thermal conductivity hydrogen sensors.
Carlos Morales Joins Ambiq As Vice President of AI
Ambiq announces that Carlos Morales has joined the company as Vice President of Artificial Intelligence (AI).
Navitas Highlights Electrification Opportunities for Next-Gen Semiconductors at Baird Global Industrial Conference
Navitas Semiconductor, a developer of gallium nitride (GaN) power integrated circuits, has announced that it will take part in Baird’s 2021 Global Industrial Conference on November 11th.
KLA Announces Grand Opening of $200 Million Second Headquarters in Ann Arbor, Michigan
KLA Corporation today announced the official opening of its second U.S. headquarters, a $200 million facility in Ann Arbor, Michigan.
Pure Storage Partners with Microsoft Azure to Speed Semiconductor Design
Pure Storage today announced it has partnered with Microsoft Azure to significantly speed next-gen chip design by delivering a data layer that can keep up with massive, concurrent high-performance computing (HPC) workloads running in the cloud.
DuPont and Kempur Microelectronics Announce Collaboration
DuPont Electronics & Industrial and Kempur Microelectronics, Inc. today announced a collaboration program to supply materials for microlithography in China.
