Mo, WF6, and Co precursors to see significant growth.
Greene Tweed Highlights Chemraz 541 High-Strength, Universal-Purpose FFKM Black Compound for Semiconductor Applications
Greene Tweed, a global manufacturer of high-performance sealing solutions and engineered components, highlights Chemraz 541, a universal-purpose, high-strength FFKM black compound engineered for reliability in demanding environments and applications such as those found in the semiconductor industry.
SIA Applauds House Introduction of Legislation to Establish Investment Tax Credit for Semiconductor Design
SIA today released the following statement from SIA President and CEO John Neuffer commending the introduction in the U.S. House of Representatives of bipartisan legislation that would expand the CHIPS and Science Act’s 25% investment tax credit to include investments in semiconductor design.
JEDEC’s JC-15 Committee Invites Industry Participation for Advancing Thermal Characterization Standards for Semiconductor Packages
JEDEC Solid State Technology Association today announced that its JC-15 Committee for Thermal Characterization Techniques for Semiconductor Packages welcomes interested companies to join JEDEC and participate in committee meetings and activities.
Ammonia-Free Gallium Nitride Semiconductor Production Improves Crystal Quality and Reduces Environmental Impact
Gallium nitride (GaN) semiconductors can now be grown without ammonia, a toxic chemical that needs a sophisticated detoxifying system before it can be released into the atmosphere.
SIA Urges Senate Passage of Tax Relief for American Families and Workers Act
The Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer, urging Senate approval of the House-passed Tax Relief for American Families and Workers Act (H.R. 7024).
Strategic Materials Conference 2024 to Explore Semiconductor Innovations Shaping the Future of Electronics and AI’s Impact
With advanced materials a critical enabler of semiconductor growth applications, Strategic Materials Conference (SMC 2024) will gather top executives and leaders from every segment of semiconductor manufacturing for insights into the latest developments in advanced materials September 30-October 2 at the Hayes Mansion in San Jose, Calif.
JEOL Releases New Schottky Field Emission Scanning Electron Microscope
JEOL Ltd. announced the release of the new Schottky Field Emission Scanning Electron Microscope JSM-IT810 on July 28, 2024.
Alphawave Semi Launches Industry’s First 3nm UCIe IP with TSMC CoWoS Packaging
Alphawave Semi has launched the industry’s first 3nm successful silicon bring-up of Universal Chiplet Interconnect Express (UCIe) Die-to-Die (D2D) IP with TSMC’s Chip-on-Wafer-on-Substrate (CoWoS) advanced packaging technology.
Nordson Electronics Solutions Completes its Europe Location Move to a New Facility
Nordson Electronics Solutions announced that their Nordson B.V. division, which covers Europe, the Middle East, and Africa, has consolidated its offices into one site in Valkenswaard, The Netherlands, in early July.
