Shannon Davis

News and Web Editor

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Shannon, writes, edits and produces Semiconductor Digest’s news articles, email newsletters, blogs, webcasts, and social media posts. She holds a bachelor’s degree in journalism from Huntington University in Huntington, IN. In addition to her years of freelance business reporting, Shannon has also worked in marketing and public relations in the renewable energy and healthcare industries.

The Busch Group Drives Sustainable Future Technologies

October 24 is International Day of Climate Action, which aims to raise awareness of climate change and to highlight the importance of environmental protection.

Fractile Licenses Andes Technology’s RISC-V Vector Processor

Andes Technology, a supplier of high-efficiency, low-power 32/64-bit RISC-V processor cores and Founding Premier member of RISC-V International, announced a partnership with Fractile, the company building the chips and systems needed to reach the next frontier of AI performance.

Broadcom President & CEO Hock Tan to Receive Global Semiconductor Alliance’s Highest Honor

Global Semiconductor Alliance (GSA) announced it will honor Hock Tan, President and CEO of Broadcom, with its prestigious Dr. Morris Chang Exemplary Leadership Award at this year’s Annual Awards Celebration on Dec. 5, 2024.

Earthquake on a Chip: Scientists Harness Sound Waves on the Surface of a Microchip

New chip design uses special glass to allow interactions between light and sound.

GlobalFoundries and NXP to Deliver Next-Generation 22FDX Solutions for Automotive, IoT and Smart Mobile

Building on years of collaboration, this new process technology collaboration will provide power-efficient and secure connectivity solutions for essential consumer and industrial applications manufactured both in Europe and the U.S.

Nord Quantique Secures Semiconductor Supply Chain Through Two New Partnerships

Nord Quantique today announced two new partnerships to secure its supply chain long-term, as it relates to chip fabrication for its quantum computers.

U.S.-Canada Collaboration Grows with Bilateral Discussions Between C2MI and NY CREATES

The cross-border collaboration between Canadian and U.S. semiconductor-centered R&D, prototyping, and manufacturing industries continues to focus on ways to connect to expand opportunities as C2MI (MiQro Innovation Collaborative Centre), based in Bromont, Québec, Canada, and NY CREATES, based in Albany, NY, build upon their partnership that began in early 2024.

SPIE Photonics West 2025 Now Open for Registration

This year, the week will include 4,500-plus technical presentations across more than 100 technical conferences, as well as hosting over 1,200 companies in four focused exhibitions.

HKU Engineering Team Develops Soft Microelectronics Technologies Enabling Wearable AI for Digital Health

Leveraging rapid technological advances for human health is a global trend, driving the rise of biomedical engineering research. A fast-rising field is wearable biosensors, which have the potential to realise digital healthcare and AI medicine.

SEMICON Japan 2024 to Expand Scope with Spotlight on Advanced Design Innovation

SEMICON Japan 2024, the largest gathering of leaders from the microelectronics manufacturing supply chain in Japan, will assemble more than 1,000 exhibitors showcasing semiconductor solutions for smart technologies from Dec. 11-13 at Tokyo Big Sight.