Jeff Wilson, a software engineer in the IBM EDA development organization, has been honored with the quarterly Silicon Integration Initiative Pinnacle Award which recognizes volunteers for their professional contributions to Si2 programs.
Breakthrough Brings Body-Heat Powered Wearable Devices Closer to Reality
A QUT-led research team has developed an ultra-thin, flexible film that could power next-generation wearable devices using body heat, eliminating the need for batteries.
ROHM and TSMC Launch Strategic Gallium Nitride Technology Collaboration for the Automotive Industry
ROHM Co., Ltd. today announced that they have entered into a strategic partnership with TSMC on the development and volume production of gallium nitride (GaN) power devices for electric vehicle applications.
ACM Research Strengthens Atomic Layer Deposition Portfolio with Qualification of Thermal and Plasma-Enhanced ALD Furnace Tools
ACM Research, Inc., a supplier of wafer processing solutions for semiconductor and advanced packaging applications, today announced the qualification of its Ultra Fn A Plasma-Enhanced Atomic Layer Deposition (PEALD) Furnace tool.
Global Trade Restrictions on Semiconductor Materials Intensify: TECHCET Offers Critical Market Insights
In a series of escalating trade measures, China announced on December 3, 2024, a complete export ban to the U.S. on rare earth materials, including gallium, germanium, antimony, and superhard materials.
Deloitte’s 16th Annual ‘Tech Trends’ Report Reveals AI Is Quickly Becoming Foundational to the Modern Enterprise
Deloitte’s 16th annual “Tech Trends” report — built on deep cross-industry experience and real-world stories — shines a light on the following trends poised to graduate from sensational to foundational over the next 18-24 months.
Rapidus Collaborates with Synopsys to Shorten Semiconductor Design Cycles
Rapidus Corporation, a manufacturer of advanced logic semiconductors, today announced that it has signed an agreement with Synopsys Inc., a provider of silicon to systems design solutions, to enable a solution that will shorten design cycle time.
Tim Keating Joins AMD as Senior Vice President, Government Relations and Regulatory Affairs
AMD today announced that Tim Keating has joined the company as senior vice president, Government Relations and Regulatory Affairs, effective today.
CEA-Leti Demonstrates Embedded FeRAM Platform Compatible with 22nm FD-SOI Node
CEA-Leti research engineers have demonstrated for the first time a scalable hafnia-zirconia-based ferroelectric capacitor platform integrated into the back-end-of-line (BEOL) at the 22nm FD-SOI technology node.
SIA Applauds Announcement of CHIPS Act Incentives for Micron Projects
The Semiconductor Industry Association applauded the U.S. Department of Commerce and Micron for finalizing semiconductor manufacturing incentives for new projects in Boise, Idaho and Clay, New York, as well as announcing new incentives for Micron’s planned expansion in Manassas, Virginia.
