Micro-sized cameras have great potential to spot problems in the human body and enable sensing for super-small robots, but past approaches captured fuzzy, distorted images with limited fields of view.
A*STAR’s Institute of Microelectronics and STMicroelectronics Team Up on Silicon Carbide R&D for the EV Market and Industrial Applications
The Institute of Microelectronics (IME) at the Agency for Science, Technology and Research (A*STAR) and STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, announced the start of a Research & Development (R&D) collaboration in the field of silicon carbide (SiC) for power-electronics applications in the automotive and industrial markets.
Advantest Announces New Versatile, High-Throughput Test Solution for NAND/Nonvolatile Flash Memory ICs
Semiconductor test equipment supplier Advantest Corporation (TSE: 6857) has introduced a new high-throughput memory tester for NAND flash devices that can perform functional testing of chips while delivering highly accurate timing, repeatability and failure detection.
CyberOptics to Deliver Technical Presentation About the Importance of 3D Inspection for Advanced Packaging at SEMICON Taiwan
CyberOptics Corporation (NASDAQ: CYBE), a developer and manufacturer of high-precision 3D sensing technology solutions will share a technical presentation at the Heterogeneous Integration Global Summit organized by SEMICON Taiwan Dec 1-3rd.
Forza Integrated Production Services Achieve Practical Yields for Back Side Illumination Sensors
Forza Silicon recently used its Integrated Production Services (IPS) to enable the production of high-speed image sensors that employ back side illumination (BSI) technology.
Sales of CMP Slurry in Semiconductor Industry to Drive Market at 7.8% CAGR
Rising demand for electronic products and increasing need to facilitate the fabrication process are some of the major factors driving the growth in CMP slurry market.
GaN Systems and USI Form Strategic Partnership to Accelerate GaN Adoption in Electric Vehicles
GaN Systems and USI have signed a strategic partnership agreement to co-develop GaN power modules for the automotive market.
CyberOptics to Deliver Technical Presentation About the Importance of 3D Inspection for Advanced Packaging at SEMICON Taiwan
CyberOptics Corporation, a global developer and manufacturer of high-precision 3D sensing technology solutions will share a technical presentation at the Heterogeneous Integration Global Summit organized by SEMICON Taiwan Dec 1-3rd.
MACOM Appoints Mr. Hualiang Xiong to President of MACOM China
MACOM Technology Solutions Inc. today announced that Mr. Hualiang Xiong has been appointed President of MACOM China.
Researchers Use AI to Optimize Several Flow Battery Properties Simultaneously
Scientists seek stable, high-energy batteries designed for the electric grid.
