IBM today unveiled a groundbreaking commitment and global plan to provide 30 million people of all ages with new skills needed for the jobs of tomorrow by 2030.
Imec Signs Licensing Agreement with miDiagnostics to Commercialize its Patented Technology for Fast and Reliable COVID-19 Diagnosis Based on Exhaled Breath
Imec and miDiagnostics announce that they have signed a non-exclusive licensing agreement for imec’s patented technology whereby aerosols and droplets from exhaled breath are captured for screening for viral RNA through miDiagnostics ultrafast PCR technology.
IC Industry at Heart of Possible China Takeover of Taiwan
Combined, China and Taiwan would hold about 37% of global IC capacity, almost 3x that of North America.
The Worldwide Quantum Dot Industry is Expected to Reach $8.6 Billion by 2026
The global quantum dot market is estimated to be worth USD 4 billion in 2021 and is projected to reach USD 8.6 billionby 2026, at a CAGR of 16.2%.
NEXTY Electronics to Distribute Blaize AI Edge Computing Products in Japan
Blaize, the AI computing innovator revolutionizing automotive and edge computing, and NEXTY Electronics Corp., a core member of the Toyota Tsusho Group, today announced NEXTY is now a Blaize distribution partner serving automotive and industrial markets for AI edge computing in Japan.
Panasonic Launches Novel Substrate Film Enabling the Development of Soft Printed Electronics
Leveraging patented thermoset polymer technology, Panasonic researchers have developed BEYOLEX, a pliable, yet durable, stretchable substrate for printed electronics and other applications.
STMicroelectronics and Sierra Wireless Collaborate to Simplify and Accelerate Connected IoT Solutions Deployment
STMicroelectronics and Sierra Wireless, an IoT services provider, have announced an agreement that will enable the STM32 microcontroller (MCU) user community to leverage flexible cellular IoT connectivity and edge-to-cloud solutions from Sierra Wireless.
Power and Compound Fab Capacity Projected to Top Record 10 Million Wafers Per Month in 2023, SEMI Reports
Fueled by pent-up demand for automotive electronics caused by semiconductor supply chain disruptions wrought by the pandemic, worldwide installed capacity for power and compound semiconductor fabs is projected to top 10 million wafers per month (WPM) for the first time in 2023, growing to 10.24 million WPM (in 200mm equivalents) and climbing to 10.6 million WPM in 2024, SEMI announced today.
Rambus Advances Server Memory Performance with the Industry’s First 5600 MT/s DDR5 Registering Clock Driver
Rambus Inc. (NASDAQ: RMBS), a chip and silicon IP provider making data faster and safer, today announced it is now sampling its 5600 MT/s 2nd-generation RCD chip to the major DDR5 memory module (RDIMM) suppliers.
SkyWater Signs Technology Transfer and License Agreement for Deca’s Gen 2 M-Series Fan-out and Adaptive Patterning Technology
SkyWater Technology, the trusted technology realization partner and Deca Technologies(Deca), a provider of advanced electronic interconnect technology, today announced an agreement for Deca’s second generation M-Series fan-out wafer-level packaging (FOWLP) technology with Adaptive Patterning within SkyWater’s advanced packaging facility in Florida.
