DuPont Interconnect Solutions (ICS), a business within the Electronics & Industrial segment, will introduce the Pyralux HP laminate adhesive system at the 2022 Institute for Printed Circuits (IPC) APEX Exposition to be held in San Diego, CA from January 25 – 27, 2022.
Toshiba Opens the Way to Longer Life Wearables and IoT Devices With New IC Chips
Minute, ultra-low quiescent current load switch ICs yield huge performance improvements.
Samsung Demonstrates the World’s First MRAM Based In-memory Computing
Samsung Electronics Co. today announced its demonstration of the world’s first in-memory computing based on MRAM.
Analog Devices’ Baoxing Chen Named IEEE Fellow
Analog Devices’ Technology Fellow Dr. Baoxing Chen has been named a 2022 IEEE Fellow for his contributions to integrated signal-power isolation and integrated magnetics.
SkyWater and Applied Novel Devices Enable Breakthrough with New Class of Silicon Power MOSFET
SkyWater Technology and Applied Novel Devices, Inc. today announced a major industry breakthrough with new transistor technology that offers significant benefits for fast switching power conversion applications.
Gelest Inc. Names Dr. Jonathan Goff as President
Gelest Inc. names Dr. Jonathan Goff as President of Gelest effective immediately.
VSORA Introduces Tyr Chip Family Enabling L2-L5 Autonomous Driving
VSORA, provider of high-performance silicon intellectual property (IP) solutions for artificial intelligence (AI), digital communications and advanced driver-assistance systems (ADAS) applications, today unveiled a family of PetaFLOPS computational companion chips to accelerate Level 3 (L3) through Level 5 (L5) autonomous vehicle designs.
TANAKA Denshi Kogyo to Establish New Plant in Hangzhou, China
TANAKA Holdings Co., Ltd. has announced that its subsidiary, TANAKA Denshi Kogyo K.K., which is engaged in the production of various types of bonding wires, will establish a new plant in Hangzhou City, China, for the production of aluminum bonding wires for power semiconductors.
SEMI Issues Recommendations for European Commission to Bolster Europe’s Chip Ecosystem Resilience and Competitiveness
SEMI, the global industry association that unites the entire electronics manufacturing and design supply chain, has issued recommendations to the European Commission for growing Europe semiconductor ecosystem resilience and competitiveness.
Micron Ships the Industry’s First 176-Layer QLC NAND in Volume and Unveils the 2400 PCIe Gen4 Client SSD
Micron Technology, Inc. today announced it has begun volume shipments of the world’s first 176-layer QLC NAND SSD. Built with the most advanced NAND architecture, Micron’s 176-layer QLC NAND delivers the industry’s leading storage density and optimized performance for a broad range of data-rich applications.
