Optimal readiness and stronger alliances across the semiconductor supply chain to confront future global disruptions will come into sharp focus at SEMICON West 2021 Hybrid, December 7-9 at the Moscone Center in San Francisco.
Nye Lubricants Launches New PFOA-Compliant Grease for Semiconductor Manufacturing
Nye Lubricants announced NyeClean 5057, a REACH-compliant, low outgassing grease for use within components in cleanroom manufacturing and vacuum environments.
High Current Rated TOLL MOSFETs from Diodes Incorporated Target EV Applications
Diodes Incorporated has introduced a portfolio of automotive MOSFETs packaged in the space saving, thermally-efficient TOLL package.
Samsung Announces Availability of Its Leading-Edge 2.5D Integration ‘H-Cube’ Solution for High Performance Applications
Samsung Electronics today announced that it has developed Hybrid-Substrate Cube (H-Cube) technology, its latest 2.5D packaging solution specialized for semiconductors for HPC, AI, data center, and network products that require high-performance and large-area packaging technology.
JSR Closes Deal to Acquire EUV Pioneer Inpria Corporation
JSR announced that it completed the acquisition of Corvallis, OR-based Inpria Corporation on Oct. 29, making it a wholly owned subsidiary of JSR.
The 2022 IEEE Symposium on VLSI Technology & Circuits Announces Call for Workshop Submissions
The 2022 IEEE Symposium on VLSI Technology & Circuits has announced a Call for Workshop topics in support of the conference theme: “Technology & Circuits for the Critical Infrastructure of the Future.”
After Strong Gains, DRAM Prices Expected To Retreat in 4Q21
DRAM buyers cautious about placing significant orders; opting instead to keep inventory in check.
Top European Research Center Selects Veeco’s Ion Beam Etch System for 5G RF Filter Production
Veeco Instruments Inc. announced today that Silicon Austria Labs (SAL) has selected Veeco’s Lancer Ion Beam Etch (IBE) System for the production of 5G RF Filters.
NXP and Ford Collaborate to Deliver Next-Generation Connected Car Experiences and Expanded Services
NXP Semiconductors today announced a collaboration with the Ford Motor Company to deliver enhanced driver experiences, convenience and services across its global fleet of vehicles, including the 2021 Ford F-150 pickup, Mustang Mach-E and Bronco SUVs.
TechSearch International’s Analysis Shows Surge in Fan-Out and Embedded Bridge for High Performance Packaging
With AMD’s announcement of its Elevated Fanout Bridge (EFB) GPU package, the embedded bridge for fan-out (FO) on substrate is in the spotlight.
