Shannon Davis

News and Web Editor

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Shannon, writes, edits and produces Semiconductor Digest’s news articles, email newsletters, blogs, webcasts, and social media posts. She holds a bachelor’s degree in journalism from Huntington University in Huntington, IN. In addition to her years of freelance business reporting, Shannon has also worked in marketing and public relations in the renewable energy and healthcare industries.

TrendForce Announces 10 Tech Industry Trends for 2022

In a recent statement, TrendForce detailed 10 major trends that are expected to take place across various segments in the tech industry.

A Simple Way to Get Complex Semiconductors to Assemble Themselves

Much like crystallizing rock candy from sugar syrup, the new method grows 2D perovskites precisely layered with other 2D materials to produce crystals with a wide range of electronic properties.

Dutch AI Semiconductor Startup Axelera AI Launches With $12 Million Seed Round

AI semiconductor startup Axelera AI announced today that it has successfully closed a seed investment round of $12 million.

Elissa Murphy Joins GlobalFoundries Board

GlobalFoundries (GF) today announced Elissa Murphy is joining the company’s board of directors with immediate effect as an independent director.

pSemi Expands APAC Footprint with New Taiwan Branch Office

pSemi Corporation, a Murata company focused on semiconductor integration, announces the opening of a branch office in Taipei City, Taiwan.

AKHAN Semiconductor Appoints Tom Lacey Interim CEO

AKHAN Semiconductor announced today that prolific technology executive Tom Lacey has added Interim CEO to his role as the Company’s Board Chairman.

Towards More Energy-Efficient 2D Semiconductor Devices

SUTD researchers show how a newly discovered family of two-dimensional (2D) semiconductors are more energy-efficient thanks to the presence of a built-in atomic protection layer.

AI Processor Chipmaker Deep Vision Raises $35 Million in Series B Funding

Deep Vision, Inc., the developers of an AI processor and comprehensive software development suite for edge computing applications, today announced that it received $35 million in a Series B financing round, led by Tiger Global.

Palomar Technologies new 3880-II Die Bonder Maximizes Productivity from R&D to Volume, Automated Bonding

Palomar Technologies today announced the availability of their new Palomar 3880-II Die Bonder.

Pfeiffer Vacuum Presents a Cloud-Based Solution for Service Management

Pfeiffer Vacuum’s new “Virtual Service Management” (VSM) is a free web app that makes it possible to manage vacuum equipment from different manufacturers.