Samco announces that the Nanofabrication Laboratory at the Pennsylvania State University Materials Research Institute (Penn State MRI Nanofab) has selected a complementary suite of surface treatment solutions from Samco consisting of an Aqua Plasma cleaning system and a UV ozone cleaning system as new additions to their specialized equipment toolsets for micro-and nanofabrication.
Backscatter Breakthrough Runs Near-Zero-Power IoT Communicators at 5G Speeds Everywhere
The promise of 5G Internet of Things (IoT) networks requires more scalable and robust communication systems — ones that deliver drastically higher data rates and lower power consumption per device.
Sourceability Global Distribution Agreement with Nexperia Broadens Sourcengine’s Component Offerings
Sourcengine today announced that it is making components from Nexperia, the expert in essential semiconductors, available worldwide.
Canaan Releases Self-developed Edge AI Chip, the Kendryte K510
Canaan Inc., a high-performance computing solutions provider, today announced the release of the Kendryte K510, an independently designed and developed RISC-V based edge AI chip, at the 2021 World Artificial Intelligence Conference.
Cirrus Logic Announces Agreement to Acquire Lion Semiconductor
Cirrus Logic, Inc. today announced that it has entered into an agreement to acquire California-based Lion Semiconductor for $335 million in cash.
3D Stacking Paves Way for Smaller, Power-Packed Computing Chips
Scientists from the Institute of Microelectronics (IME) at the Agency for Science, Technology and Research (A*STAR) have developed breakthrough technology that can stack up to four layers of wafers, potentially decreasing the cost of production by 50 per cent.
A*STAR’s Institute of Microelectronics Teams with Major Industry Players in High Density System-in-Package Consortium for Heterogenous Chiplets Integration
The newly formed consortium will leverage IME’s expertise in FOWLP/2.5D/3D packaging.
Winbond HyperRAM & SpiStack and Renesas RZ/A2M Accelerate the Construction of Embedded AI Systems
Winbond Electronics Corporation, a global supplier of semiconductor memory solutions, announced today the official confirmation that its HyperRAM and SpiStack (NOR+NAND) can be operated with Renesas’ RZ/A2M Arm-based microprocessors (MPUs).
Shortage Threat to Semiconductor Materials from US Chip Expansion Plans
Is the US wet chemical supply-demand out of balance?
Rambus Completes Acquisition of AnalogX
Rambus Inc., a provider of chips and silicon IP making data faster and safer, today announced the completion of the acquisition of AnalogX.
