Veeco Instruments Inc. announced today that Silicon Austria Labs (SAL) has selected Veeco’s Lancer Ion Beam Etch (IBE) System for the production of 5G RF Filters.
NXP and Ford Collaborate to Deliver Next-Generation Connected Car Experiences and Expanded Services
NXP Semiconductors today announced a collaboration with the Ford Motor Company to deliver enhanced driver experiences, convenience and services across its global fleet of vehicles, including the 2021 Ford F-150 pickup, Mustang Mach-E and Bronco SUVs.
TechSearch International’s Analysis Shows Surge in Fan-Out and Embedded Bridge for High Performance Packaging
With AMD’s announcement of its Elevated Fanout Bridge (EFB) GPU package, the embedded bridge for fan-out (FO) on substrate is in the spotlight.
Allegro MicroSystems Announces Changes to its Board of Directors
Allegro MicroSystems, Inc., a developer of sensing and power semiconductor technology, today announced the appointment of Susan Lynch to Allegro’s Board of Directors and its Audit Committee, replacing Christine King, who is leaving the board.
Gallium Semi Selects Nijmegen, Netherlands for European R&D Center
Gallium Semiconductor launches its European research and development (R&D) center in Nijmegen, Netherlands
NVIDIA Sets Path for Future of Edge AI and Autonomous Machines With New Jetson AGX Orin Robotics Computer
NVIDIA today introduced NVIDIA Jetson AGX Orin, the world’s smallest, most powerful and energy-efficient AI supercomputer for robotics, autonomous machines, medical devices and other forms of embedded computing at the edge.
New Senior Appointment at Smart Tech Company, amBX
amBX announced today that it has appointed Jonathan Couch as Product and Solutions Director, a brand-new role for the business.
Primo1D Raises 15M Euros for Industrial-Scale Deployment
Primo1D today announced a new funding round of 15 million euros from major French capital funds.
aveni, SA Secures Patent For Groundbreaking, One-Step 3D NAND Wet Deposition Process That Replaces ALD And CVD Technologies
aveni SA today announced that it has secured a patent that can extend the industry standard of layers from 100 to 200+ layers on a single wafer for 3D NAND memory devices.
Samsung Develops Industry’s First LPDDR5X DRAM
Samsung Electronics Co., Ltd. today announced that it has developed the industry’s first 14-nanometer (nm) based 16-gigabit (Gb) Low Power Double Data Rate 5X (LPDDR5X) DRAM, designed to drive further growth throughout the high-speed data service applications including 5G, artificial intelligence (AI) and the metaverse.
